Study of low-temperature wafer bonding with Au-Au bonding technique

H. Kurotaki, H. Shinohara, H. Kobayashi, Jun Mizuno, Shuichi Shoji

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)
Original languageEnglish
Title of host publication2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008
Pages747-748
Number of pages2
DOIs
Publication statusPublished - 2008
Event2008 ASME 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008 - Kowloon
Duration: 2008 Jun 32008 Jun 5

Other

Other2008 ASME 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008
CityKowloon
Period08/6/308/6/5

Fingerprint

Wafer bonding
Temperature

ASJC Scopus subject areas

  • Biotechnology
  • Electrical and Electronic Engineering

Cite this

Kurotaki, H., Shinohara, H., Kobayashi, H., Mizuno, J., & Shoji, S. (2008). Study of low-temperature wafer bonding with Au-Au bonding technique. In 2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008 (pp. 747-748) https://doi.org/10.1115/MicroNano2008-70064

Study of low-temperature wafer bonding with Au-Au bonding technique. / Kurotaki, H.; Shinohara, H.; Kobayashi, H.; Mizuno, Jun; Shoji, Shuichi.

2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008. 2008. p. 747-748.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kurotaki, H, Shinohara, H, Kobayashi, H, Mizuno, J & Shoji, S 2008, Study of low-temperature wafer bonding with Au-Au bonding technique. in 2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008. pp. 747-748, 2008 ASME 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008, Kowloon, 08/6/3. https://doi.org/10.1115/MicroNano2008-70064
Kurotaki H, Shinohara H, Kobayashi H, Mizuno J, Shoji S. Study of low-temperature wafer bonding with Au-Au bonding technique. In 2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008. 2008. p. 747-748 https://doi.org/10.1115/MicroNano2008-70064
Kurotaki, H. ; Shinohara, H. ; Kobayashi, H. ; Mizuno, Jun ; Shoji, Shuichi. / Study of low-temperature wafer bonding with Au-Au bonding technique. 2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008. 2008. pp. 747-748
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