Study of low-temperature wafer bonding with Au-Au bonding technique

H. Kurotaki, H. Shinohara, H. Kobayashi, J. Mizuno, S. Shoji

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)
Original languageEnglish
Title of host publication2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008
Pages747-748
Number of pages2
DOIs
Publication statusPublished - 2008 Dec 1
Event2008 ASME 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008 - Kowloon, Hong Kong
Duration: 2008 Jun 32008 Jun 5

Publication series

Name2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008

Conference

Conference2008 ASME 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008
CountryHong Kong
CityKowloon
Period08/6/308/6/5

ASJC Scopus subject areas

  • Biotechnology
  • Electrical and Electronic Engineering

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