Study of low-temperature wafer bonding with Au-Au bonding technique

H. Kurotaki, H. Shinohara, H. Kobayashi, J. Mizuno, S. Shoji

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)
Original languageEnglish
Title of host publication2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008
Pages747-748
Number of pages2
DOIs
Publication statusPublished - 2008 Dec 1
Event2008 ASME 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008 - Kowloon, Hong Kong
Duration: 2008 Jun 32008 Jun 5

Publication series

Name2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008

Conference

Conference2008 ASME 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008
Country/TerritoryHong Kong
CityKowloon
Period08/6/308/6/5

ASJC Scopus subject areas

  • Biotechnology
  • Electrical and Electronic Engineering

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