Study on a Rheological Analysis System of LSI Packaging Molds (1st Report)

Kazuhiro Sugino, Shingo Akasaka, Hisashi Onari

Research output: Contribution to journalArticle

Abstract

A rheological analysis system of molds was developed with the purpose of improving the yield of molded plastic semiconductor packages and shortening the time required for mold design. The capability for formulation of analytical models, which constitutes the salient feature of this system, will be described in the present paper. This system does not directly model the entire object of analysis, but rather models portions of this object and then integrates these into an overall analytical model. Approximate modelling is effected in such a manner that preprepared standard programs can be used in the respective partial models. The process of synthesizing the analytical model is represented by a hierachical structure of frames, and modelling is accomplished via the three stages of shape partitioning, shape allocation and model decision.

Original languageEnglish
Pages (from-to)789-793
Number of pages5
JournalSeimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Volume61
Issue number6
DOIs
Publication statusPublished - 1995
Externally publishedYes

Fingerprint

Molds
Analytical models
Packaging
Semiconductor materials
Plastics

Keywords

  • analytical model formulation
  • flow analysis system
  • knowledge engineering
  • LSI packaging mold
  • rheological analysis

ASJC Scopus subject areas

  • Mechanical Engineering

Cite this

Study on a Rheological Analysis System of LSI Packaging Molds (1st Report). / Sugino, Kazuhiro; Akasaka, Shingo; Onari, Hisashi.

In: Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering, Vol. 61, No. 6, 1995, p. 789-793.

Research output: Contribution to journalArticle

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