Study on the bend performance of package stackable very thin fine pitch ball grid array assemblies with edge and corner bond adhesives

Hongbin Shi, Toshitsugu Ueda

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    8 Citations (Scopus)

    Abstract

    This paper presents the four-point bend test results for edge and corner bonded 0.5mm pitch lead-free package stackable very thin fine pitch ball grid arrays (PSvfBGAs) as package-on-package (PoP) bottom packages on a standard IPC/JEDEC bend test board. Four-point bend tests were carried out based on the above standard with a 30 mm loading span, 90 mm support span and 7.5 mm/sec crosshead speed. The daisy chain resistance, strain, crosshead displacement and load of each PSvfBGA were measured and a 20% increase in the resistance was used as the failure criterion. Materials used in this study were a UV-cured acrylic edge bond adhesive, a thermal-cured epoxy edge bond adhesive and a thermal-cured epoxy corner bond adhesive. Tests were conducted on PSvfBGAs with adhesives and PSvfBGAs without bonding. The test results show that all of them can improve the bend performance significantly; especially the edge bond epoxy increased the crosshead displacement, strain and bending force when mechanical damage occurred by 33.46%, 26.74% and 3.05% respectively. The combination of high module adhesive and edge bond dispensing pattern can provide the best improvement. Failure analysis indicated that the most common failure mode was PCB pad lift/crater.

    Original languageEnglish
    Title of host publicationICCRD2011 - 2011 3rd International Conference on Computer Research and Development
    Pages421-425
    Number of pages5
    Volume3
    DOIs
    Publication statusPublished - 2011
    Event2011 3rd International Conference on Computer Research and Development, ICCRD 2011 - Shanghai
    Duration: 2011 Mar 112011 Mar 15

    Other

    Other2011 3rd International Conference on Computer Research and Development, ICCRD 2011
    CityShanghai
    Period11/3/1111/3/15

    Keywords

    • adhesives
    • corner bond
    • edge bond
    • four-point bend test
    • package stackable very thin fine pitch ball grid array (PSvfBGA)

    ASJC Scopus subject areas

    • Computer Science Applications

    Fingerprint Dive into the research topics of 'Study on the bend performance of package stackable very thin fine pitch ball grid array assemblies with edge and corner bond adhesives'. Together they form a unique fingerprint.

  • Cite this

    Shi, H., & Ueda, T. (2011). Study on the bend performance of package stackable very thin fine pitch ball grid array assemblies with edge and corner bond adhesives. In ICCRD2011 - 2011 3rd International Conference on Computer Research and Development (Vol. 3, pp. 421-425). [5764228] https://doi.org/10.1109/ICCRD.2011.5764228