Study on the bend performance of package stackable very thin fine pitch ball grid array assemblies with edge and corner bond adhesives

Hongbin Shi, Toshitsugu Ueda

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    8 Citations (Scopus)

    Abstract

    This paper presents the four-point bend test results for edge and corner bonded 0.5mm pitch lead-free package stackable very thin fine pitch ball grid arrays (PSvfBGAs) as package-on-package (PoP) bottom packages on a standard IPC/JEDEC bend test board. Four-point bend tests were carried out based on the above standard with a 30 mm loading span, 90 mm support span and 7.5 mm/sec crosshead speed. The daisy chain resistance, strain, crosshead displacement and load of each PSvfBGA were measured and a 20% increase in the resistance was used as the failure criterion. Materials used in this study were a UV-cured acrylic edge bond adhesive, a thermal-cured epoxy edge bond adhesive and a thermal-cured epoxy corner bond adhesive. Tests were conducted on PSvfBGAs with adhesives and PSvfBGAs without bonding. The test results show that all of them can improve the bend performance significantly; especially the edge bond epoxy increased the crosshead displacement, strain and bending force when mechanical damage occurred by 33.46%, 26.74% and 3.05% respectively. The combination of high module adhesive and edge bond dispensing pattern can provide the best improvement. Failure analysis indicated that the most common failure mode was PCB pad lift/crater.

    Original languageEnglish
    Title of host publicationICCRD2011 - 2011 3rd International Conference on Computer Research and Development
    Pages421-425
    Number of pages5
    Volume3
    DOIs
    Publication statusPublished - 2011
    Event2011 3rd International Conference on Computer Research and Development, ICCRD 2011 - Shanghai
    Duration: 2011 Mar 112011 Mar 15

    Other

    Other2011 3rd International Conference on Computer Research and Development, ICCRD 2011
    CityShanghai
    Period11/3/1111/3/15

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    Keywords

    • adhesives
    • corner bond
    • edge bond
    • four-point bend test
    • package stackable very thin fine pitch ball grid array (PSvfBGA)

    ASJC Scopus subject areas

    • Computer Science Applications

    Cite this

    Shi, H., & Ueda, T. (2011). Study on the bend performance of package stackable very thin fine pitch ball grid array assemblies with edge and corner bond adhesives. In ICCRD2011 - 2011 3rd International Conference on Computer Research and Development (Vol. 3, pp. 421-425). [5764228] https://doi.org/10.1109/ICCRD.2011.5764228