Study on the low energy consumption thermal head using electroless Ni-W-P alloy films as heating resistors

Hideo Sawai, Takashi Kanamori, Ichiro Koiwa, Susumu Shibata, Koji Nihei, Tetsuya Osaka

Research output: Contribution to journalArticle

17 Citations (Scopus)

Abstract

The new type of thermal head with an electroless Ni-W-P film on a polyimide film substrates was investigated for the purpose of low cost and low energy consumption. The electroless plating method attained a fine patterned heating element and the polyimide substrate worked as a heat-insulating layer with a lower heat conductivity. In our simulation, the applied power was reduced about 50% by using polyimide film as the heat-insulating layer. The accumulation of heat could be suppressed by controlling the polyimide film thickness without reducing the advantage of low energy consumption. The new head, composed of screen-printed polyimide resin with SiC powder (10 μm thick) as the protective layer, an electroless Ni-W-P film (0.25 μm thick) as the heating element, a polyimide film (50 μm thick) as the heat-insulating layer, and an Al board (3.0 mm) as the heat sink, was produced. The new head shows the same dot size as that of the conventional thin-film-type head produced by vacuum technology, and its cost is lower than that of the conventional thin-film-type head. The new head produces the good printing quality with 60% of the power required by the conventional one. Therefore, the new head provides low cost and low energy consumption.

Original languageEnglish
Pages (from-to)3653-3660
Number of pages8
JournalJournal of the Electrochemical Society
Volume137
Issue number11
Publication statusPublished - 1990 Nov

Fingerprint

energy consumption
polyimides
Polyimides
resistors
Resistors
Energy utilization
Heating
heat
heating
Electric heating elements
polyimide resins
Vacuum technology
Costs
Thin films
Electroless plating
heat sinks
Heat sinks
Substrates
thin films
plating

ASJC Scopus subject areas

  • Electrochemistry
  • Surfaces, Coatings and Films
  • Surfaces and Interfaces

Cite this

Study on the low energy consumption thermal head using electroless Ni-W-P alloy films as heating resistors. / Sawai, Hideo; Kanamori, Takashi; Koiwa, Ichiro; Shibata, Susumu; Nihei, Koji; Osaka, Tetsuya.

In: Journal of the Electrochemical Society, Vol. 137, No. 11, 11.1990, p. 3653-3660.

Research output: Contribution to journalArticle

Sawai, Hideo ; Kanamori, Takashi ; Koiwa, Ichiro ; Shibata, Susumu ; Nihei, Koji ; Osaka, Tetsuya. / Study on the low energy consumption thermal head using electroless Ni-W-P alloy films as heating resistors. In: Journal of the Electrochemical Society. 1990 ; Vol. 137, No. 11. pp. 3653-3660.
@article{f603144640d642f3a9d8193c95177d53,
title = "Study on the low energy consumption thermal head using electroless Ni-W-P alloy films as heating resistors",
abstract = "The new type of thermal head with an electroless Ni-W-P film on a polyimide film substrates was investigated for the purpose of low cost and low energy consumption. The electroless plating method attained a fine patterned heating element and the polyimide substrate worked as a heat-insulating layer with a lower heat conductivity. In our simulation, the applied power was reduced about 50{\%} by using polyimide film as the heat-insulating layer. The accumulation of heat could be suppressed by controlling the polyimide film thickness without reducing the advantage of low energy consumption. The new head, composed of screen-printed polyimide resin with SiC powder (10 μm thick) as the protective layer, an electroless Ni-W-P film (0.25 μm thick) as the heating element, a polyimide film (50 μm thick) as the heat-insulating layer, and an Al board (3.0 mm) as the heat sink, was produced. The new head shows the same dot size as that of the conventional thin-film-type head produced by vacuum technology, and its cost is lower than that of the conventional thin-film-type head. The new head produces the good printing quality with 60{\%} of the power required by the conventional one. Therefore, the new head provides low cost and low energy consumption.",
author = "Hideo Sawai and Takashi Kanamori and Ichiro Koiwa and Susumu Shibata and Koji Nihei and Tetsuya Osaka",
year = "1990",
month = "11",
language = "English",
volume = "137",
pages = "3653--3660",
journal = "Journal of the Electrochemical Society",
issn = "0013-4651",
publisher = "Electrochemical Society, Inc.",
number = "11",

}

TY - JOUR

T1 - Study on the low energy consumption thermal head using electroless Ni-W-P alloy films as heating resistors

AU - Sawai, Hideo

AU - Kanamori, Takashi

AU - Koiwa, Ichiro

AU - Shibata, Susumu

AU - Nihei, Koji

AU - Osaka, Tetsuya

PY - 1990/11

Y1 - 1990/11

N2 - The new type of thermal head with an electroless Ni-W-P film on a polyimide film substrates was investigated for the purpose of low cost and low energy consumption. The electroless plating method attained a fine patterned heating element and the polyimide substrate worked as a heat-insulating layer with a lower heat conductivity. In our simulation, the applied power was reduced about 50% by using polyimide film as the heat-insulating layer. The accumulation of heat could be suppressed by controlling the polyimide film thickness without reducing the advantage of low energy consumption. The new head, composed of screen-printed polyimide resin with SiC powder (10 μm thick) as the protective layer, an electroless Ni-W-P film (0.25 μm thick) as the heating element, a polyimide film (50 μm thick) as the heat-insulating layer, and an Al board (3.0 mm) as the heat sink, was produced. The new head shows the same dot size as that of the conventional thin-film-type head produced by vacuum technology, and its cost is lower than that of the conventional thin-film-type head. The new head produces the good printing quality with 60% of the power required by the conventional one. Therefore, the new head provides low cost and low energy consumption.

AB - The new type of thermal head with an electroless Ni-W-P film on a polyimide film substrates was investigated for the purpose of low cost and low energy consumption. The electroless plating method attained a fine patterned heating element and the polyimide substrate worked as a heat-insulating layer with a lower heat conductivity. In our simulation, the applied power was reduced about 50% by using polyimide film as the heat-insulating layer. The accumulation of heat could be suppressed by controlling the polyimide film thickness without reducing the advantage of low energy consumption. The new head, composed of screen-printed polyimide resin with SiC powder (10 μm thick) as the protective layer, an electroless Ni-W-P film (0.25 μm thick) as the heating element, a polyimide film (50 μm thick) as the heat-insulating layer, and an Al board (3.0 mm) as the heat sink, was produced. The new head shows the same dot size as that of the conventional thin-film-type head produced by vacuum technology, and its cost is lower than that of the conventional thin-film-type head. The new head produces the good printing quality with 60% of the power required by the conventional one. Therefore, the new head provides low cost and low energy consumption.

UR - http://www.scopus.com/inward/record.url?scp=0025522721&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0025522721&partnerID=8YFLogxK

M3 - Article

AN - SCOPUS:0025522721

VL - 137

SP - 3653

EP - 3660

JO - Journal of the Electrochemical Society

JF - Journal of the Electrochemical Society

SN - 0013-4651

IS - 11

ER -