Submicrometer-sized polystyrene particles packing on silicon microfabricated substrate

Manabu Tanaka, Naonobu Shimamoto, Takashi Tanii, Iwao Ohdomari, Hiroyuki Nishide

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The Packing of submicrometer-sized polystyrene particle within micro-boxes; micrometer-sized squarely recessed pits, was achieved using silicon microfabricated substrates and a simple dipping and pulling-up process. A special phenomenon, cubic packing structures of the particles, was observed when using a micro-box substrate with a few times larger side-length than the particle diameters. Several particle packing structures within different sized micro-boxes were demonstrated, and the relationship between the particle packing structures and micro-box sizes were discussed.

Original languageEnglish
Title of host publicationAssembly at the Nanoscale
Subtitle of host publicationToward Functional Nanostructured Materials
Pages330-335
Number of pages6
Publication statusPublished - 2005 Dec 1
Event2005 MRS Fall Meeting - Boston, MA, United States
Duration: 2005 Nov 282005 Dec 2

Publication series

NameMaterials Research Society Symposium Proceedings
Volume901
ISSN (Print)0272-9172

Other

Other2005 MRS Fall Meeting
CountryUnited States
CityBoston, MA
Period05/11/2805/12/2

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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  • Cite this

    Tanaka, M., Shimamoto, N., Tanii, T., Ohdomari, I., & Nishide, H. (2005). Submicrometer-sized polystyrene particles packing on silicon microfabricated substrate. In Assembly at the Nanoscale: Toward Functional Nanostructured Materials (pp. 330-335). (Materials Research Society Symposium Proceedings; Vol. 901).