Substrate (Ni)-catalyzed electroless gold deposition from a noncyanide bath containing thiosulfate and sulfite I. Reaction mechanism

M. Kato, J. Sato, H. Otani, Takayuki Homma, Y. Okinaka, Tetsuya Osaka, O. Yoshioka

Research output: Contribution to journalArticle

38 Citations (Scopus)

Abstract

Electroless gold deposition is known to take place on Ni-based substrates even when the conventional reducing agent is excluded from the autocatalytic bath containing thiosulfate and sulfite as ligands for gold ions. It is shown in this paper that the reaction of gold deposition from this bath on electroless Ni-B substrate is not autocatalytic but, instead, proceeds primarily by the mechanism of substrate catalysis with galvanic displacement playing a secondary role. It was established that sulfite serves as the reducing agent for the substrate-catalyzed gold deposition reaction.

Original languageEnglish
JournalJournal of the Electrochemical Society
Volume149
Issue number3
DOIs
Publication statusPublished - 2002 Mar

Fingerprint

Thiosulfates
sulfites
Sulfites
Gold
baths
gold
Reducing Agents
Reducing agents
Substrates
Catalysis
catalysis
Ligands
Ions
ligands
ions

ASJC Scopus subject areas

  • Electrochemistry
  • Surfaces, Coatings and Films
  • Surfaces and Interfaces

Cite this

Substrate (Ni)-catalyzed electroless gold deposition from a noncyanide bath containing thiosulfate and sulfite I. Reaction mechanism. / Kato, M.; Sato, J.; Otani, H.; Homma, Takayuki; Okinaka, Y.; Osaka, Tetsuya; Yoshioka, O.

In: Journal of the Electrochemical Society, Vol. 149, No. 3, 03.2002.

Research output: Contribution to journalArticle

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