Suppression of stress induced drain leakage current of SOI MOSFETs by using partial trench isolation technology

T. Iwamatsu, T. Ipposhi, T. Uchida, S. Maegawa, M. Inuishi

Research output: Contribution to conferencePaper

4 Citations (Scopus)

Abstract

The partial trench isolated (PTI) structure of SOI MOSFETs was studied using stress simulation and compared with the fully trench isolation (FTI) structure. The oxidation-induced stress during trench isolation process of the PTI structure was found to be lower than those of the FTI structure. This was because the oxidant diffusion to the SOI bottom surface was easily suppressed in the PTI SOI MOSFETs. The high yield drain leakage current characteristics of the PTI SOI MOSFETs were presented.

Original languageEnglish
Pages80-81
Number of pages2
Publication statusPublished - 2000 Dec 1
Externally publishedYes

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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