Surface Activated Bonding Method for Low Temperature Bonding

Tadatomo Suga, Fengwen Mu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The surface activated bonding (SAB) method for low temperature bonding: its development for heterogeneous and 3D integration is reviewed. The standard SAB method is based on surface bombardment by Ar beam in ultra-high vacuum to clean the surfaces so that they can be bonded very strongly at room temperature without heat treatment. Modifications of the surface activation have been investigated to extend the standard SAB method for various materials and applications.

Original languageEnglish
Title of host publication2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781538668139
DOIs
Publication statusPublished - 2018 Nov 26
Externally publishedYes
Event7th Electronic System-Integration Technology Conference, ESTC 2018 - Dresden, Germany
Duration: 2018 Sep 182018 Sep 21

Publication series

Name2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings

Other

Other7th Electronic System-Integration Technology Conference, ESTC 2018
CountryGermany
CityDresden
Period18/9/1818/9/21

Fingerprint

Temperature
Ultrahigh vacuum
Chemical activation
Heat treatment

Keywords

  • bonding
  • interface
  • room-temperature bonding
  • SAB
  • surface activated bonding
  • surface activation

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Suga, T., & Mu, F. (2018). Surface Activated Bonding Method for Low Temperature Bonding. In 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings [8546367] (2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ESTC.2018.8546367

Surface Activated Bonding Method for Low Temperature Bonding. / Suga, Tadatomo; Mu, Fengwen.

2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2018. 8546367 (2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Suga, T & Mu, F 2018, Surface Activated Bonding Method for Low Temperature Bonding. in 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings., 8546367, 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings, Institute of Electrical and Electronics Engineers Inc., 7th Electronic System-Integration Technology Conference, ESTC 2018, Dresden, Germany, 18/9/18. https://doi.org/10.1109/ESTC.2018.8546367
Suga T, Mu F. Surface Activated Bonding Method for Low Temperature Bonding. In 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2018. 8546367. (2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings). https://doi.org/10.1109/ESTC.2018.8546367
Suga, Tadatomo ; Mu, Fengwen. / Surface Activated Bonding Method for Low Temperature Bonding. 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2018. (2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings).
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