Surface compliant bonding properties of low-temperature wafer bonding using sub-micron Au particles

Hiroyuki Ishida, Toshinori Ogashiwa, Yukio Kanehira, Hiroshi Murai, Takuya Yazaki, Shin Ito, Jun Mizuno

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

Compression deformation property, which is directly related to an ability of surface compliant bonding and hermetic sealing, of low-temperature wafer bonding using sub-micron Au particles was studied. Wafer bonding test using 0.3 μm particles demonstrated excellent hermeticity with He leak rate better than 1 × 10-9 Pa·m3/s even on a substrate with a surface topography of a few μm. Cross-section SEM observation of the patterns with different particle sizes demonstrated that special voids are smaller in 0.1 μm particle patterns compared to that in 0.3 μm particle patterns. Deformation measurement revealed that 0.1μm particle patterns with initial height of 17 μm deformed by 9.4 μm after pressed at 100 MPa, which is fairly larger than that of 6.2 μm for 0.3 μm Au particles. This result can indicate that patterns with smaller size Au particles can be hermetically bonded at lower applied pressure.

Original languageEnglish
Title of host publication2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
Pages1519-1523
Number of pages5
DOIs
Publication statusPublished - 2013 Sep 9
Event2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013 - Las Vegas, NV, United States
Duration: 2013 May 282013 May 31

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Conference

Conference2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
CountryUnited States
CityLas Vegas, NV
Period13/5/2813/5/31

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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  • Cite this

    Ishida, H., Ogashiwa, T., Kanehira, Y., Murai, H., Yazaki, T., Ito, S., & Mizuno, J. (2013). Surface compliant bonding properties of low-temperature wafer bonding using sub-micron Au particles. In 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013 (pp. 1519-1523). [6575773] (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2013.6575773