Surface compliant bonding properties of low-temperature wafer bonding using sub-micron Au particles

Hiroyuki Ishida, Toshinori Ogashiwa, Yukio Kanehira, Hiroshi Murai, Takuya Yazaki, Shin Ito, Jun Mizuno

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Surface compliant bonding properties of low-temperature wafer bonding using sub-micron Au particles'. Together they form a unique fingerprint.

Engineering & Materials Science

Chemical Compounds