Systematic studies of second level interconnection reliability of edge and corner bonded lead-free array-based packages under mechanical and thermal loading

Hongbin Shi*, Daquan Yu, Toshitsugu Ueda

*Corresponding author for this work

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    4 Citations (Scopus)

    Fingerprint

    Dive into the research topics of 'Systematic studies of second level interconnection reliability of edge and corner bonded lead-free array-based packages under mechanical and thermal loading'. Together they form a unique fingerprint.

    Engineering & Materials Science

    Chemical Compounds