Temperature controlled dispersion of poly(n-isopropyl acrylamide) treated silica clusters

Luciana Bava, Donald L. Feke, Manas Zloczower Ica, Stuart J. Rowan

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

The dispersion of particle agglomerates is affected by the presence of any chemical additives incorporated within the agglomerate structure. Traditional additives change the particle-particle and particle-matrix interactions to a degree that depends primarily on the chemical nature of the additive and its concentration within the agglomerate. A new generation of additives, based on polymeric systems that respond to external stimuli, allows the adjustment of interparticle interactions by manipulating the variable to which the additive is responsive. In this study, dispersion tests in simple shear flow are used to examine the effect of a thermally responsive additive, poly(N-isopropyl acrylamide) (PNIPAM), on the dispersion behavior of silica agglomerates. The temperature sensitivity of the dispersion mechanisms and kinetics for silica clusters treated with either linear or crosslinked PNIPAM has been examined.

Original languageEnglish
Pages (from-to)809-820
Number of pages12
JournalRubber Chemistry and Technology
Volume81
Issue number5
Publication statusPublished - 2008 Nov
Externally publishedYes

Fingerprint

Acrylamide
Silicon Dioxide
Silica
Temperature
Shear flow
Kinetics
poly-N-isopropylacrylamide

ASJC Scopus subject areas

  • Polymers and Plastics
  • Materials Chemistry

Cite this

Temperature controlled dispersion of poly(n-isopropyl acrylamide) treated silica clusters. / Bava, Luciana; Feke, Donald L.; Ica, Manas Zloczower; Rowan, Stuart J.

In: Rubber Chemistry and Technology, Vol. 81, No. 5, 11.2008, p. 809-820.

Research output: Contribution to journalArticle

Bava, Luciana ; Feke, Donald L. ; Ica, Manas Zloczower ; Rowan, Stuart J. / Temperature controlled dispersion of poly(n-isopropyl acrylamide) treated silica clusters. In: Rubber Chemistry and Technology. 2008 ; Vol. 81, No. 5. pp. 809-820.
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