Termination with Stubs in Resistive Film

Hidenori Ishibashi*, Yukihiro Tarui, Yuko Onodera, Toru Takahashi, Naofumi Yoneda, Moriyasu Miyazaki

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In recent years, T/R modules have required surface mount terminations with high-power capability for cost reduction. Terminations with large resistive film on aluminum nitride have been proposed as a method for high power use. However, they have a problem that it is difficult to obtain the broadband terminations. Therefore, we propose a novel termination with stubs in resistive film. This termination can disperse heat by resonating an input signal with open stubs. Hence, the proposed termination improved surface loss density by 50% compared to the conventional one. In addition, we show that the fabricated termination has the reflection coefficient characteristics smaller than-20B in the bandwidth of 43.3%.

Original languageEnglish
Title of host publication2020 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2020
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages49-51
Number of pages3
ISBN (Electronic)9781728165066
DOIs
Publication statusPublished - 2020 Sep
Externally publishedYes
Event2020 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2020 - Hiroshima, Japan
Duration: 2020 Sep 22020 Sep 4

Publication series

Name2020 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2020

Conference

Conference2020 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2020
Country/TerritoryJapan
CityHiroshima
Period20/9/220/9/4

Keywords

  • broadband
  • high-power capability
  • resistive film
  • stub
  • termination

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Radiation

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