The effect of solid-state nanoporous Cu bonding for power device

Byungho Park, Duy le Han, Mikiko Saito, Jun Mizuno, Hiroshi Nishikawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Recently, the sintered nanoparticle has received an attention as a replacement for high temperature lead-based solder in the electronic device packaging due to its great thermal conductivity, mechanical properties and high melting temperature. However, there are still some problems such as controlling the thickness and the formation of unexpected voids caused by evaporation of solvent. In this study, nanoporous Cu (NPC) bonding process was developed to achieve a Cu-Cu bonding without solvent and flux. NPC sheet was fabricated by dealloying from cold-rolled Mn-Cu precursor. The effect of bonding temperatures (200–400 °C), pressure (2.5–20 MPa), and atmospheres (N2 and formic acid) on the joint strength of NPC bonding was investigated. The bonding mechanism was investigated by fracture surface of NPC bonding, as well as cross-sectional sample. These results revealed that the NPC bonding was closely related with the oxide layer formed on the NPC surface due to the interruption of diffusion between NPC and substrate.

Original languageEnglish
Title of host publication2021 International Conference on Electronics Packaging, ICEP 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages159-160
Number of pages2
ISBN (Electronic)9784991191114
DOIs
Publication statusPublished - 2021 May 12
Event20th International Conference on Electronics Packaging, ICEP 2021 - Tokyo, Japan
Duration: 2021 May 122021 May 14

Publication series

Name2021 International Conference on Electronics Packaging, ICEP 2021

Conference

Conference20th International Conference on Electronics Packaging, ICEP 2021
Country/TerritoryJapan
CityTokyo
Period21/5/1221/5/14

Keywords

  • Cold-rolling
  • Die-attachment
  • Diffusion
  • Nanoporous
  • Power device

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanics of Materials
  • Electronic, Optical and Magnetic Materials
  • Instrumentation

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