Si nanopillars were prepared by electrodeposition from SiCl4 in an ionic liquid, specifically tri-methyl-n-hexyl ammonium bis- (trifluorosulfonyl) imide (TMHATFSI), and the effects of the various deposition conditions, such as bath temperature and deposition potential, were investigated. For the preparation of the patterned substrates, UV-nanoimprint lithography was employed. The thickness of resist was 90-100 nm, mold feature diameter was 150 nm, with a pitch of 450 nm. As a result, compact Si nanopillars were uniformly electrodeposited, and it was indicated that their morphology were affected mostly by the bath temperature.
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