The effect of the deposition conditions on the electrodeposition of Si nanopillars in TMHATFSI

Yoko Ishibashi, Takahiro Akiyoshi, Jason Komadina, Yasuhiro Fukunaka, Takayuki Homma

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    1 Citation (Scopus)

    Abstract

    Si nanopillars were prepared by electrodeposition from SiCl 4 in an ionic liquid, specifically tri-methyl-n-hexyl ammonium bis- (trifluorosulfonyl) imide (TMHATFSI), and the effects of the various deposition conditions, such as bath temperature and deposition potential, were investigated. For the preparation of the patterned substrates, UV-nanoimprint lithography was employed. The thickness of resist was 90-100 nm, mold feature diameter was 150 nm, with a pitch of 450 nm. As a result, compact Si nanopillars were uniformly electrodeposited, and it was indicated that their morphology were affected mostly by the bath temperature.

    Original languageEnglish
    Title of host publicationECS Transactions
    Pages117-126
    Number of pages10
    Volume50
    Edition48
    DOIs
    Publication statusPublished - 2012

      Fingerprint

    ASJC Scopus subject areas

    • Engineering(all)

    Cite this

    Ishibashi, Y., Akiyoshi, T., Komadina, J., Fukunaka, Y., & Homma, T. (2012). The effect of the deposition conditions on the electrodeposition of Si nanopillars in TMHATFSI. In ECS Transactions (48 ed., Vol. 50, pp. 117-126) https://doi.org/10.1149/05048.0117ecst