The proposal of all-wet fabrication process for ulsi interconnects technologies - Application of electroless NiB deposition to capping and barrier layers

Masahiro Yoshino*, Yuichi Nonaka, Tokihiko Yokoshima, Tetsuya Osaka

*Corresponding author for this work

Research output: Contribution to conference › Paper › peer-review

1 Citation (Scopus)

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Engineering & Materials Science