The proposal of all-wet fabrication process for ulsi interconnects technologies - Application of electroless NiB deposition to capping and barrier layers

Masahiro Yoshino*, Yuichi Nonaka, Tokihiko Yokoshima, Tetsuya Osaka

*Corresponding author for this work

Research output: Contribution to conferencePaperpeer-review

1 Citation (Scopus)

Fingerprint

Dive into the research topics of 'The proposal of all-wet fabrication process for ulsi interconnects technologies - Application of electroless NiB deposition to capping and barrier layers'. Together they form a unique fingerprint.

Engineering & Materials Science