The rate limiting process and its activation energy in the forming process of a Cu/Ta2O5/Pt gapless-type atomic switch

Yuki Shigeoka, Tohru Tsuruoka, Tsuyoshi Hasegawa

    Research output: Contribution to journalArticle

    1 Citation (Scopus)

    Abstract

    The rate limiting process in first resistive switching, called the "forming process", is determined by measuring the switching time of an as-fabricated Cu/Ta2O5/Pt atomic switch as a function of the ambient temperature and the Ta2O5 thickness. The temperature dependence is well fitted by the Arrhenius equation, suggesting that a certain activation process dominates the switching phenomenon. The switching time increases linearly as the Ta2O5 thickness increases. The results herein clearly suggest that the rate limiting process is the drift of Cu cations in the Ta2O5 layer. We determine that the activation energy is 0.4 eV.

    Original languageEnglish
    Article number035202
    JournalJapanese Journal of Applied Physics
    Volume57
    Issue number3
    DOIs
    Publication statusPublished - 2018 Mar 1

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    switches
    Activation energy
    Switches
    activation energy
    ambient temperature
    Positive ions
    Chemical activation
    activation
    cations
    Temperature
    temperature dependence

    ASJC Scopus subject areas

    • Engineering(all)
    • Physics and Astronomy(all)

    Cite this

    The rate limiting process and its activation energy in the forming process of a Cu/Ta2O5/Pt gapless-type atomic switch. / Shigeoka, Yuki; Tsuruoka, Tohru; Hasegawa, Tsuyoshi.

    In: Japanese Journal of Applied Physics, Vol. 57, No. 3, 035202, 01.03.2018.

    Research output: Contribution to journalArticle

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