Thermal-based skin moisture device with contact pressure sensor

K. Katoh, Y. Ichikawa, E. Iwase, K. Matsumoto, I. Shimoyama

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

This paper reports on a thermal-based device for measuring water content in human skin. The device consists of resistive temperature detectors (RTD) and a pressure sensor. The RTD was also used as a heat source, and the pressure sensor was used to obtain constant thermal contact. Water content was measured by heat extraction rate across device interface under constant contact pressure. The device detected difference in water content of a contact object from 0.02 to 0.56g/cm3 by measuring step response of the RTD in 3 seconds. Difference in water content of the human skin was actually detectable with the device in 3 seconds.

Original languageEnglish
Title of host publicationMEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest
Pages276-279
Number of pages4
DOIs
Publication statusPublished - 2010 Jun 1
Event23rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2010 - Hong Kong, China
Duration: 2010 Jan 242010 Jan 28

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Conference

Conference23rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2010
CountryChina
CityHong Kong
Period10/1/2410/1/28

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Katoh, K., Ichikawa, Y., Iwase, E., Matsumoto, K., & Shimoyama, I. (2010). Thermal-based skin moisture device with contact pressure sensor. In MEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest (pp. 276-279). [5442513] (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). https://doi.org/10.1109/MEMSYS.2010.5442513