Thermal bond reliability of high reliability gold alloy wires for automotive IC's

Tomohiro Uno, Keiichi Kimura, Kohei Tatsumi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

Semiconductors for high temperature become increasingly important for automotive applications and power devices. High thermal interconnection technology is requested. Commercial 4N gold wire (purity>99.99%) caused a bond corrosion problem at elevated temperatures. Thermal bond reliability of gold alloy wire was investigated with HP alloy wire and LP alloy wire which include high and low concentration palladium, respectively. The bond strength of HP wire declined faster than 4N wire after aging at 423K. There were Pd-enriched compound and cracking at bond interface of HP wire. LP wire can exceed the target of 423K-2000hr for reliability testing. The alloy wire was also suitable for fine pitch bonding. In this paper, bond failure mechanism was clarified and high thermal reliability bonding wires developed were shown.

Original languageEnglish
Title of host publicationProceedings - 2005 International Symposium on Microelectronics, IMAPS 2005
Pages557-565
Number of pages9
Publication statusPublished - 2005
Externally publishedYes
Event38th International Symposium on Microelectronics, IMAPS 2005 - Philadelphia, PA
Duration: 2005 Sep 252005 Sep 29

Other

Other38th International Symposium on Microelectronics, IMAPS 2005
CityPhiladelphia, PA
Period05/9/2505/9/29

Fingerprint

Gold alloys
Wire
Hot Temperature
Palladium
Aging of materials
Gold
Corrosion
Semiconductor materials

Keywords

  • Automotive IC
  • Bonding wire
  • Corrosion
  • Intermetallic compound
  • Reliability

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Uno, T., Kimura, K., & Tatsumi, K. (2005). Thermal bond reliability of high reliability gold alloy wires for automotive IC's. In Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005 (pp. 557-565)

Thermal bond reliability of high reliability gold alloy wires for automotive IC's. / Uno, Tomohiro; Kimura, Keiichi; Tatsumi, Kohei.

Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005. 2005. p. 557-565.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Uno, T, Kimura, K & Tatsumi, K 2005, Thermal bond reliability of high reliability gold alloy wires for automotive IC's. in Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005. pp. 557-565, 38th International Symposium on Microelectronics, IMAPS 2005, Philadelphia, PA, 05/9/25.
Uno T, Kimura K, Tatsumi K. Thermal bond reliability of high reliability gold alloy wires for automotive IC's. In Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005. 2005. p. 557-565
Uno, Tomohiro ; Kimura, Keiichi ; Tatsumi, Kohei. / Thermal bond reliability of high reliability gold alloy wires for automotive IC's. Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005. 2005. pp. 557-565
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