Thermal characteristic evaluation and transient thermal analysis of next-generation sic power module at 250 °C

Akihiro Imakiire, Masahiro Kozako, Masayuki Hikta, Kohei Tatsumi, Masakazu Inagaki, Tomonori Iizuka, Hiroaki Narimatsu, Nobuaki Sato, Koji Shimizu, Kazutoshi Ueda, Kazuhiko Sugiura, Kazuhiro Tsuruta, Makio Iida, Keiji Toda

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

In recent years, the demand for the operation of SiC power modules under high temperatures has emerged. The authors have so far investigated prototype SiC power modules using Ni micro plating bonding [NMPB] for junction temperatures driven at 250 °C. This paper presents the thermal characteristics and transient thermal analysis of a prototype novel SiC power module using NMPB, and compares with those of the conventional structure power module using high-temperature solder. Furthermore, we attempt to estimate and analyze the thermal resistance in a power module using a structure function derived from transient thermal analysis to discuss the delamination or void formation caused by a power cycling test.

Original languageEnglish
Title of host publicationCIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
PublisherVDE VERLAG GMBH
Pages174-179
Number of pages6
ISBN (Electronic)9783800745401
Publication statusPublished - 2018
Event10th International Conference on Integrated Power Electronics Systems, CIPS 2018 - Stuttgart, Germany
Duration: 2018 Mar 202018 Mar 22

Publication series

NameCIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

Conference

Conference10th International Conference on Integrated Power Electronics Systems, CIPS 2018
Country/TerritoryGermany
CityStuttgart
Period18/3/2018/3/22

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Energy Engineering and Power Technology

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