Thermal fatigue properties and grain boundary character distribution of lead-free Sn-1.2Ag-0.5Cu solder interconnects on WLP

Shinichi Terashima, Takayuki Kobayashi, Shinji Ishikawa, Tsutomu Sasaki, Kohei Tatsumi, Masamoto Tanakaupu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Both drop reliability and thermal fatigue properties of modified-LF35, a commercial low-silver type solder, and Sn-xAg-0.5mass%Cu (x: 1 and 3 mass%) lead-free solders on Casio's wafer level packages were discussed. LF35 had superior drop reliability than SAC105 or SAC305. However, LF35 of a standard type and SAC105 showed the shorterr thermal fatigue life than SAC305. Hence, thermal fatigue properties of LF35 was improved by modifying its chemical composition. Both cracks, which were initiated by thermal strain, and grain-boundary damage due to grain-boundary sliding degraded the thermal fatigue lives. From a microstructural observation using orientation imaging microscopy (OIM), both modified-LF35 and SAC305 suppressed coarsening of tin grains due to thermal strain as compared with SAC105. Moreover, both modified-LF35 and SAC305 showed a larger amount of coincidence site lattice (CSL) boundaries than SAC105. It is suggested that not only smaller tin grains but also larger amount of CSL boundaries observed in modified-LF35 and for SAC305 suppressed crack propagation and grain-boundary damage.

Original languageEnglish
Title of host publicationIMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Global Business Council, GBC 2008 Spring Conference
Pages73-78
Number of pages6
Publication statusPublished - 2008
Externally publishedYes
EventIMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Spring Conference on Global Business Council, GBC 2008 - Scottsdale, AZ
Duration: 2008 Mar 172008 Mar 17

Other

OtherIMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Spring Conference on Global Business Council, GBC 2008
CityScottsdale, AZ
Period08/3/1708/3/17

Fingerprint

Thermal fatigue
Soldering alloys
Grain boundaries
Lead
Tin
Fatigue of materials
Grain boundary sliding
Coarsening
Silver
Crack propagation
Microscopic examination
Cracks
Imaging techniques
Chemical analysis
Hot Temperature

Keywords

  • Drop reliability
  • Grain boundary character distribution
  • Lead-free solder
  • Orientation imaging microscopy
  • Sn-Ag-Cu
  • Thermal fatigue

ASJC Scopus subject areas

  • Surfaces, Coatings and Films

Cite this

Terashima, S., Kobayashi, T., Ishikawa, S., Sasaki, T., Tatsumi, K., & Tanakaupu, M. (2008). Thermal fatigue properties and grain boundary character distribution of lead-free Sn-1.2Ag-0.5Cu solder interconnects on WLP. In IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Global Business Council, GBC 2008 Spring Conference (pp. 73-78)

Thermal fatigue properties and grain boundary character distribution of lead-free Sn-1.2Ag-0.5Cu solder interconnects on WLP. / Terashima, Shinichi; Kobayashi, Takayuki; Ishikawa, Shinji; Sasaki, Tsutomu; Tatsumi, Kohei; Tanakaupu, Masamoto.

IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Global Business Council, GBC 2008 Spring Conference. 2008. p. 73-78.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Terashima, S, Kobayashi, T, Ishikawa, S, Sasaki, T, Tatsumi, K & Tanakaupu, M 2008, Thermal fatigue properties and grain boundary character distribution of lead-free Sn-1.2Ag-0.5Cu solder interconnects on WLP. in IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Global Business Council, GBC 2008 Spring Conference. pp. 73-78, IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Spring Conference on Global Business Council, GBC 2008, Scottsdale, AZ, 08/3/17.
Terashima S, Kobayashi T, Ishikawa S, Sasaki T, Tatsumi K, Tanakaupu M. Thermal fatigue properties and grain boundary character distribution of lead-free Sn-1.2Ag-0.5Cu solder interconnects on WLP. In IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Global Business Council, GBC 2008 Spring Conference. 2008. p. 73-78
Terashima, Shinichi ; Kobayashi, Takayuki ; Ishikawa, Shinji ; Sasaki, Tsutomu ; Tatsumi, Kohei ; Tanakaupu, Masamoto. / Thermal fatigue properties and grain boundary character distribution of lead-free Sn-1.2Ag-0.5Cu solder interconnects on WLP. IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Global Business Council, GBC 2008 Spring Conference. 2008. pp. 73-78
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