Thermal fatigue properties and grain boundary character distribution of lead-free Sn-1.2Ag-0.5Cu solder interconnects on WLP

Shinichi Terashima, Takayuki Kobayashi, Shinji Ishikawa, Tsutomu Sasaki, Kohei Tatsumi, Masamoto Tanakaupu

Research output: Contribution to conferencePaperpeer-review

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Engineering & Materials Science

Chemical Compounds