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Thermal fatigue properties and grain boundary character distribution of lead-free Sn-1.2Ag-0.5Cu solder interconnects on WLP
Shinichi Terashima, Takayuki Kobayashi, Shinji Ishikawa, Tsutomu Sasaki, Kohei Tatsumi, Masamoto Tanakaupu
Research output: Contribution to conference › Paper › peer-review