Thermal reliability of gold - aluminum bonds encapsulated in bi-phenyl epoxy resin

Tomohiro Uno, Kohei Tatsumi

Research output: Contribution to journalArticle

45 Citations (Scopus)

Abstract

Bond degradation of Au wire/A1 pad has become a major problem, because of the use of molding resin with low thermal stability (e.g. bi-phenyl epoxy resin) and the use of the IC devices under high thermal environments. It is therefore important to insure the thermal reliability at Au/Al bonds. The lifetime to bond failure of bi-phenyl epoxy molding became shorter than that for cresol novolac epoxy. The failures were caused by the corrosion reaction of Au-Al intermetallics with bromine (Br) contained in the resin compounds. It was clarified that the reactive intermetallic was Au4Al phase formed in the bond interface. The governing factors of the bond corrosion were investigated such as resin compound and gold wire material. Especially some impurities in gold wire could affect the Au-Al intermetallic growing and therefore retard the corrosion. The use of the alloyed wire was effective in improving the bond reliability.

Original languageEnglish
Pages (from-to)145-153
Number of pages9
JournalMicroelectronics Reliability
Volume40
Issue number1
Publication statusPublished - 2000 Jan 14
Externally publishedYes

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Safety, Risk, Reliability and Quality
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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