Thermal reliability of gold - aluminum bonds encapsulated in bi-phenyl epoxy resin

Tomohiro Uno, Kohei Tatsumi

Research output: Contribution to journalArticle

43 Citations (Scopus)

Abstract

Bond degradation of Au wire/A1 pad has become a major problem, because of the use of molding resin with low thermal stability (e.g. bi-phenyl epoxy resin) and the use of the IC devices under high thermal environments. It is therefore important to insure the thermal reliability at Au/Al bonds. The lifetime to bond failure of bi-phenyl epoxy molding became shorter than that for cresol novolac epoxy. The failures were caused by the corrosion reaction of Au-Al intermetallics with bromine (Br) contained in the resin compounds. It was clarified that the reactive intermetallic was Au4Al phase formed in the bond interface. The governing factors of the bond corrosion were investigated such as resin compound and gold wire material. Especially some impurities in gold wire could affect the Au-Al intermetallic growing and therefore retard the corrosion. The use of the alloyed wire was effective in improving the bond reliability.

Original languageEnglish
Pages (from-to)145-153
Number of pages9
JournalMicroelectronics Reliability
Volume40
Issue number1
Publication statusPublished - 1999
Externally publishedYes

Fingerprint

Epoxy Resins
epoxy resins
Aluminum
Epoxy resins
Gold
wire
Wire
resins
gold
Intermetallics
aluminum
intermetallics
corrosion
cresol
Resins
Corrosion
Molding
Gold Compounds
Bromine
cresols

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Thermal reliability of gold - aluminum bonds encapsulated in bi-phenyl epoxy resin. / Uno, Tomohiro; Tatsumi, Kohei.

In: Microelectronics Reliability, Vol. 40, No. 1, 1999, p. 145-153.

Research output: Contribution to journalArticle

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