Thermal resistance and transient thermal analysis of sic power module using ni micro plating bonding

Akihiro Imakiire, Masahiro Kozako, Masayuki Hikita, Kohei Tatsumi, Masakazu Inagaki, Tomonori Iizuka, Nobuaki Sato, Koji Shimizu, Kazutoshi Ueda, Kazuhiko Sugiura, Kazuhiro Tsuruta, Keiji Toda

Research output: Contribution to journalArticle

Abstract

This paper deals with the thermal resistance and thermal conduction characteristics of a Nickel Micro Plating Bonding (NMPB) power module in comparison with those of a power module adapting a conventional structure with a high-temperature solder attachment. An attempt is made to estimate the thermal resistance and thermal structure function for the two types of power modules when peeling of the chip junction occurs. In terms of spreading heat, an NMPB is superior to a conventional power module using high temperature solder, because NMPB allows spreading heat from both sides of the chip and setting the heat spreader near the chip.

Original languageEnglish
Pages (from-to)838-846
Number of pages9
Journalieej transactions on industry applications
Volume139
Issue number10
DOIs
Publication statusPublished - 2019 Jan 1
Externally publishedYes

Keywords

  • Lead frame
  • Nickel micro plating bonding
  • Power module
  • Sic
  • Thermal resistance
  • Transient thermal analysis

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Imakiire, A., Kozako, M., Hikita, M., Tatsumi, K., Inagaki, M., Iizuka, T., Sato, N., Shimizu, K., Ueda, K., Sugiura, K., Tsuruta, K., & Toda, K. (2019). Thermal resistance and transient thermal analysis of sic power module using ni micro plating bonding. ieej transactions on industry applications, 139(10), 838-846. https://doi.org/10.1541/ieejias.139.838