THERMAL STABILITY OF ELECTROLESS NICKEL-TUNGSTEN-PHOSPHORUS ALLOY FILMS.

Hideo Sawai, Takashi Kanamori, Susumu Shibata, Kohji Nihei, Tetsuya Osaka, Ichiro Koiwa, Masao Nishikawa

Research output: Contribution to conferencePaper

6 Citations (Scopus)

Abstract

The thermal stability of the resistivity of electroless Ni-W-P films was investigated for applications to thin film resistors. The tungsten codeposition into Ni-P films greatly improved the thermal stability and uniformity of electric resistivity of films.

Original languageEnglish
Pages323-328
Number of pages6
Publication statusPublished - 1984 Dec 1

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ASJC Scopus subject areas

  • Engineering(all)

Cite this

Sawai, H., Kanamori, T., Shibata, S., Nihei, K., Osaka, T., Koiwa, I., & Nishikawa, M. (1984). THERMAL STABILITY OF ELECTROLESS NICKEL-TUNGSTEN-PHOSPHORUS ALLOY FILMS.. 323-328.