Thermally stable CGC perpendicular recording media with Pt-rich CoPtCr and thin Pt layers

Y. Sonobe*, H. Muraoka, K. Miura, Y. Nakamura, K. Takano, A. Moser, H. Do, B. K. Yen, Y. Ikeda, N. Supper, W. Weresin

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

39 Citations (Scopus)

Abstract

Thermal stability of coupled granular/continuous (CGC) perpendicular media is supported by fundamental modeling and experimental results, including spin-stand testing. By incorporating the interlayer exchange coupling into the model, the simulation result suggests that the CGC structure is capable of achieving the energy barrier of KuV/kB T required for 1 Tbit/in2 recording density. To demonstrate the CGC approach, we investigate a new class of CGC perpendicular media consisting of a Pt-rich CoPtCr layer with poor Co-Cr phase segregation and a thin Pt layer. The addition of these layers improves the nucleation field of the CoCr18Pt12 medium from +420 to -600 Oe and the thermal decay of the output is reduced from 2.23% to 0.10% per decade. Unity squareness was obtained by using a thin Pt capping layer and resulted in a small decay rate of 0.21% per decade. The new CGC media showed no degradation of SNR compared to the base granular medium. Similar to CGC media utilizing a multilayer capping structure, the CGC medium with a Pt-rich CoPtCr or Pt capping structure improved the thermal stability without compromising SNR. The simplicity of these new CGC structures also greatly simplifies the deposition process.

Original languageEnglish
Pages (from-to)2006-2011
Number of pages6
JournalIEEE Transactions on Magnetics
Volume38
Issue number5 I
DOIs
Publication statusPublished - 2002 Sep
Externally publishedYes
Event2002 International Magnetics Conference (Intermag 2002) - Amsterdam, Netherlands
Duration: 2002 Apr 282002 May 2

Keywords

  • Continuous layer
  • Granular layer
  • Perpendicular media
  • Pt layer
  • Signal-to-noise ratio
  • Thermal stability

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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