Thermo-compression micro bonding technology using Au - Bonding technologies with Sub-micron au particles and Au-adhesive hybrid bonding

Jun Mizuno, Katsuyuki Sakuma, Masatsugu Nimura, Fumihiro Wakai, Shuichi Shoji

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)714-718
Number of pages5
JournalSeimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Volume79
Issue number8
DOIs
Publication statusPublished - 2013 Aug

Keywords

  • Au
  • Hybrid bonding
  • Lock-and-key
  • Sub-micron Au particle
  • Thermo-compression bonding
  • Underfill

ASJC Scopus subject areas

  • Mechanical Engineering

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