@article{aeaf54f92b0a4dc5b4689e02f3e0fd5d,
title = "Thermo-compression micro bonding technology using Au - Bonding technologies with Sub-micron au particles and Au-adhesive hybrid bonding",
keywords = "Au, Hybrid bonding, Lock-and-key, Sub-micron Au particle, Thermo-compression bonding, Underfill",
author = "Jun Mizuno and Katsuyuki Sakuma and Masatsugu Nimura and Fumihiro Wakai and Shuichi Shoji",
year = "2013",
month = aug,
doi = "10.2493/jjspe.79.714",
language = "English",
volume = "79",
pages = "714--718",
journal = "Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering",
issn = "0912-0289",
publisher = "Japan Society for Precision Engineering",
number = "8",
}