Thermo-compression micro bonding technology using Au - Bonding technologies with Sub-micron au particles and Au-adhesive hybrid bonding

Jun Mizuno, Katsuyuki Sakuma, Masatsugu Nimura, Fumihiro Wakai, Shuichi Shoji

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)714-718
Number of pages5
JournalSeimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Volume79
Issue number8
Publication statusPublished - 2013 Aug
Externally publishedYes

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Adhesives

Keywords

  • Au
  • Hybrid bonding
  • Lock-and-key
  • Sub-micron Au particle
  • Thermo-compression bonding
  • Underfill

ASJC Scopus subject areas

  • Mechanical Engineering

Cite this

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title = "Thermo-compression micro bonding technology using Au - Bonding technologies with Sub-micron au particles and Au-adhesive hybrid bonding",
keywords = "Au, Hybrid bonding, Lock-and-key, Sub-micron Au particle, Thermo-compression bonding, Underfill",
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journal = "Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering",
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AU - Wakai, Fumihiro

AU - Shoji, Shuichi

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KW - Au

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KW - Lock-and-key

KW - Sub-micron Au particle

KW - Thermo-compression bonding

KW - Underfill

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VL - 79

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JO - Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering

JF - Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering

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