Thermo-mechanical reliability optimization of MEMS-based quartz resonator using validated finite element model

Rui Zhang, Hongbin Shi, Yuehong Dai, Jong Tae Park, Toshitsugu Ueda

    Research output: Contribution to journalArticle

    4 Citations (Scopus)

    Abstract

    This paper presents the investigation of the thermal mechanical reliability of a hydrogen gas sensor using MEMS-based quartz resonator by finite element analysis (FEA). The hydrogen gas senor has an internal heat source when in operating, the quartz resonator may subjected to thermal stress due to the thermal expansion coefficients (CTE) mismatch between the resonator and the LTCC package. This could cause cracks on the resonator and finally lead to failure of the sensor. Both thermal and thermo-mechanical simulations of a 3D model of the sensor were built using ANSYS software. Higher thermal mechanical stress level was found in the resonator based on the FEA, which is consistent with the results of verified experiments. Some optimal design was also carried out to improve the thermal reliability of the resonator based on validated finite element model.

    Original languageEnglish
    Pages (from-to)2331-2335
    Number of pages5
    JournalMicroelectronics Reliability
    Volume52
    Issue number9-10
    DOIs
    Publication statusPublished - 2012 Sep

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Electronic, Optical and Magnetic Materials
    • Surfaces, Coatings and Films
    • Atomic and Molecular Physics, and Optics
    • Condensed Matter Physics
    • Safety, Risk, Reliability and Quality

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