Thermolysis of reactive oligo(p‐phenylene sulfide) containing disulfide bond

Kenichi Oyaizu, Junya Katoh, Fumiaki Suzuki, Mitsutoshi Jikei, Kimihisa Yamamoto, Hiroyuki Nishide, Eishun Tsuchida

Research output: Contribution to journalArticle

7 Citations (Scopus)

Abstract

Oligo(phenylene sulfide) (OPS) containing one disulfide bond at the end of the chain, which was obtained by the oxidative polymerization of diphenyl disulfide, had a relatively low Td10%(temperature for 10% weight loss) of 412 °C because of degradation of the disulfide bond. But this thermal cleavage of the disulfide bond promoted the curing reaction through thiophenoxy radical formation. OPS was allowed to react with diiodobenzene at 220 °C. The thermal stability of OPS was improved through the consumption of the disulfide bond and the coupling of the chain.

Original languageEnglish
Pages (from-to)155-159
Number of pages5
JournalPolymers for Advanced Technologies
Volume2
Issue number3
DOIs
Publication statusPublished - 1991

Fingerprint

Thermolysis
Sulfides
Disulfides
Curing
Thermodynamic stability
Polymerization
Degradation
Temperature
Hot Temperature

Keywords

  • Disulfide
  • Oligo(phenylene sulfide)
  • Thermolysis

ASJC Scopus subject areas

  • Polymers and Plastics

Cite this

Thermolysis of reactive oligo(p‐phenylene sulfide) containing disulfide bond. / Oyaizu, Kenichi; Katoh, Junya; Suzuki, Fumiaki; Jikei, Mitsutoshi; Yamamoto, Kimihisa; Nishide, Hiroyuki; Tsuchida, Eishun.

In: Polymers for Advanced Technologies, Vol. 2, No. 3, 1991, p. 155-159.

Research output: Contribution to journalArticle

Oyaizu, Kenichi ; Katoh, Junya ; Suzuki, Fumiaki ; Jikei, Mitsutoshi ; Yamamoto, Kimihisa ; Nishide, Hiroyuki ; Tsuchida, Eishun. / Thermolysis of reactive oligo(p‐phenylene sulfide) containing disulfide bond. In: Polymers for Advanced Technologies. 1991 ; Vol. 2, No. 3. pp. 155-159.
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