Thermomechanical reliability analysis and optimization for MEMS packages with AuSn solder

Rui Zhang, Hongbin Shi, Toshitsugu Ueda, Jiong Zhang, Yuehong Dai

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    3 Citations (Scopus)

    Abstract

    Thermal stress formed in the solder of the microelectromechanical systems (MEMS) sensor during the reflow soldering process due to the coefficients of thermal expansion (CTE) mismatch between the different materials. As the package needs to be hermetically sealed to protect the device from outside environmental effects, the local stress concentration would eventually cause cracks in the solder and influence the hermeticity. In this study, we present the thermo-mechanical analysis of the AuSn90 solder with low temperature co-fired ceramic (LTCC) package using Comsol Multiphysics. Thermal residual stress distribution in the solder after the reflow soldering process was simulated. According to the result, the maximum von Mises stress was found and several possible ways for minimizing the stress in the solder and improving the thermo-mechanical reliability were discussed.

    Original languageEnglish
    Title of host publicationProceedings of 2012 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering, ICQR2MSE 2012
    Pages794-797
    Number of pages4
    DOIs
    Publication statusPublished - 2012
    Event2012 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering, ICQR2MSE 2012 - Chengdu
    Duration: 2012 Jun 152012 Jun 18

    Other

    Other2012 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering, ICQR2MSE 2012
    CityChengdu
    Period12/6/1512/6/18

    Fingerprint

    Reliability analysis
    Soldering alloys
    MEMS
    Soldering
    Thermal stress
    Stress concentration
    Thermal expansion
    Environmental impact
    Residual stresses
    Cracks
    Sensors
    Temperature

    Keywords

    • FEA
    • MEMS
    • optimal designing
    • reliability
    • thermal stress

    ASJC Scopus subject areas

    • Safety, Risk, Reliability and Quality

    Cite this

    Zhang, R., Shi, H., Ueda, T., Zhang, J., & Dai, Y. (2012). Thermomechanical reliability analysis and optimization for MEMS packages with AuSn solder. In Proceedings of 2012 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering, ICQR2MSE 2012 (pp. 794-797). [6246348] https://doi.org/10.1109/ICQR2MSE.2012.6246348

    Thermomechanical reliability analysis and optimization for MEMS packages with AuSn solder. / Zhang, Rui; Shi, Hongbin; Ueda, Toshitsugu; Zhang, Jiong; Dai, Yuehong.

    Proceedings of 2012 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering, ICQR2MSE 2012. 2012. p. 794-797 6246348.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Zhang, R, Shi, H, Ueda, T, Zhang, J & Dai, Y 2012, Thermomechanical reliability analysis and optimization for MEMS packages with AuSn solder. in Proceedings of 2012 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering, ICQR2MSE 2012., 6246348, pp. 794-797, 2012 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering, ICQR2MSE 2012, Chengdu, 12/6/15. https://doi.org/10.1109/ICQR2MSE.2012.6246348
    Zhang R, Shi H, Ueda T, Zhang J, Dai Y. Thermomechanical reliability analysis and optimization for MEMS packages with AuSn solder. In Proceedings of 2012 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering, ICQR2MSE 2012. 2012. p. 794-797. 6246348 https://doi.org/10.1109/ICQR2MSE.2012.6246348
    Zhang, Rui ; Shi, Hongbin ; Ueda, Toshitsugu ; Zhang, Jiong ; Dai, Yuehong. / Thermomechanical reliability analysis and optimization for MEMS packages with AuSn solder. Proceedings of 2012 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering, ICQR2MSE 2012. 2012. pp. 794-797
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    abstract = "Thermal stress formed in the solder of the microelectromechanical systems (MEMS) sensor during the reflow soldering process due to the coefficients of thermal expansion (CTE) mismatch between the different materials. As the package needs to be hermetically sealed to protect the device from outside environmental effects, the local stress concentration would eventually cause cracks in the solder and influence the hermeticity. In this study, we present the thermo-mechanical analysis of the AuSn90 solder with low temperature co-fired ceramic (LTCC) package using Comsol Multiphysics. Thermal residual stress distribution in the solder after the reflow soldering process was simulated. According to the result, the maximum von Mises stress was found and several possible ways for minimizing the stress in the solder and improving the thermo-mechanical reliability were discussed.",
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