Thermomechanical reliability analysis and optimization for MEMS packages with AuSn solder

Rui Zhang; Hongbin Shi; Toshitsugu Ueda; Jiong Zhang; Yuehong Dai

doi:10.1109/ICQR2MSE.2012.6246348

Thermomechanical reliability analysis and optimization for MEMS packages with AuSn solder

Rui Zhang^*, Hongbin Shi, Toshitsugu Ueda, Jiong Zhang, Yuehong Dai

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Citations (Scopus)

Abstract

Thermal stress formed in the solder of the microelectromechanical systems (MEMS) sensor during the reflow soldering process due to the coefficients of thermal expansion (CTE) mismatch between the different materials. As the package needs to be hermetically sealed to protect the device from outside environmental effects, the local stress concentration would eventually cause cracks in the solder and influence the hermeticity. In this study, we present the thermo-mechanical analysis of the AuSn90 solder with low temperature co-fired ceramic (LTCC) package using Comsol Multiphysics. Thermal residual stress distribution in the solder after the reflow soldering process was simulated. According to the result, the maximum von Mises stress was found and several possible ways for minimizing the stress in the solder and improving the thermo-mechanical reliability were discussed.

Original language	English
Title of host publication	Proceedings of 2012 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering, ICQR2MSE 2012
Pages	794-797
Number of pages	4
DOIs	https://doi.org/10.1109/ICQR2MSE.2012.6246348
Publication status	Published - 2012
Event	2012 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering, ICQR2MSE 2012 - Chengdu Duration: 2012 Jun 15 → 2012 Jun 18

Other

Other	2012 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering, ICQR2MSE 2012
City	Chengdu
Period	12/6/15 → 12/6/18

Keywords

FEA
MEMS
optimal designing
reliability
thermal stress

ASJC Scopus subject areas

Safety, Risk, Reliability and Quality

Access to Document

10.1109/ICQR2MSE.2012.6246348

Cite this

Thermomechanical reliability analysis and optimization for MEMS packages with AuSn solder. / Zhang, Rui; Shi, Hongbin; Ueda, Toshitsugu et al.

Proceedings of 2012 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering, ICQR2MSE 2012. 2012. p. 794-797 6246348.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Zhang, R, Shi, H, Ueda, T, Zhang, J & Dai, Y 2012, Thermomechanical reliability analysis and optimization for MEMS packages with AuSn solder. in Proceedings of 2012 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering, ICQR2MSE 2012., 6246348, pp. 794-797, 2012 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering, ICQR2MSE 2012, Chengdu, 12/6/15. https://doi.org/10.1109/ICQR2MSE.2012.6246348

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title = "Thermomechanical reliability analysis and optimization for MEMS packages with AuSn solder",

abstract = "Thermal stress formed in the solder of the microelectromechanical systems (MEMS) sensor during the reflow soldering process due to the coefficients of thermal expansion (CTE) mismatch between the different materials. As the package needs to be hermetically sealed to protect the device from outside environmental effects, the local stress concentration would eventually cause cracks in the solder and influence the hermeticity. In this study, we present the thermo-mechanical analysis of the AuSn90 solder with low temperature co-fired ceramic (LTCC) package using Comsol Multiphysics. Thermal residual stress distribution in the solder after the reflow soldering process was simulated. According to the result, the maximum von Mises stress was found and several possible ways for minimizing the stress in the solder and improving the thermo-mechanical reliability were discussed.",

keywords = "FEA, MEMS, optimal designing, reliability, thermal stress",

author = "Rui Zhang and Hongbin Shi and Toshitsugu Ueda and Jiong Zhang and Yuehong Dai",

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AU - Zhang, Rui

AU - Shi, Hongbin

AU - Ueda, Toshitsugu

AU - Zhang, Jiong

AU - Dai, Yuehong

PY - 2012

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N2 - Thermal stress formed in the solder of the microelectromechanical systems (MEMS) sensor during the reflow soldering process due to the coefficients of thermal expansion (CTE) mismatch between the different materials. As the package needs to be hermetically sealed to protect the device from outside environmental effects, the local stress concentration would eventually cause cracks in the solder and influence the hermeticity. In this study, we present the thermo-mechanical analysis of the AuSn90 solder with low temperature co-fired ceramic (LTCC) package using Comsol Multiphysics. Thermal residual stress distribution in the solder after the reflow soldering process was simulated. According to the result, the maximum von Mises stress was found and several possible ways for minimizing the stress in the solder and improving the thermo-mechanical reliability were discussed.

AB - Thermal stress formed in the solder of the microelectromechanical systems (MEMS) sensor during the reflow soldering process due to the coefficients of thermal expansion (CTE) mismatch between the different materials. As the package needs to be hermetically sealed to protect the device from outside environmental effects, the local stress concentration would eventually cause cracks in the solder and influence the hermeticity. In this study, we present the thermo-mechanical analysis of the AuSn90 solder with low temperature co-fired ceramic (LTCC) package using Comsol Multiphysics. Thermal residual stress distribution in the solder after the reflow soldering process was simulated. According to the result, the maximum von Mises stress was found and several possible ways for minimizing the stress in the solder and improving the thermo-mechanical reliability were discussed.

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KW - optimal designing

KW - reliability

KW - thermal stress

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ER -

Thermomechanical reliability analysis and optimization for MEMS packages with AuSn solder

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Keywords

ASJC Scopus subject areas

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