Three-dimensional integration of heterogeneous silicon micro-structures by liftoff and stamping transfer

Hiroaki Onoe, Eiji Iwase, Kiyoshi Matsumoto, Isao Shimoyama

Research output: Contribution to journalArticle

26 Citations (Scopus)

Abstract

We propose a method of integrating heterogeneous silicon microstructures (typical scale of 10-100 νm) into a single silicon substrate to fabricate MEMS structures. It includes adhesion-based liftoff and stamping transfer (LIST) processes using poly-(dimethylsiloxane) (PDMS) sheets. Silicon microstructures fabricated on different wafers are lifted onto the PDMS sheets by breaking the narrow columns supporting the microstructures by applying a vertical load to the PDMS sheet, and then transferred onto the silicon substrate with high yield (more than 90%) and superior positioning accuracy (within 0.3 νm on average in a 2 × 3 mm area). Multiple heterogeneous silicon structures are integrated into a single silicon substrate by repeating this LIST process. We fabricated two-dimensional arrays, three-dimensional pyramidal structures and overhanging bridge microstructures with our method, which proved that the LIST process could be used to integrate heterogeneous MEMS structures into a single wafer.

Original languageEnglish
Pages (from-to)1818-1827
Number of pages10
JournalJournal of Micromechanics and Microengineering
Volume17
Issue number9
DOIs
Publication statusPublished - 2007 Sep 1
Externally publishedYes

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stamping
Stamping
Silicon
microstructure
Microstructure
silicon
Polydimethylsiloxane
microelectromechanical systems
MEMS
Substrates
wafers
positioning
adhesion
Adhesion
baysilon

ASJC Scopus subject areas

  • Instrumentation
  • Materials Science(all)
  • Mechanics of Materials
  • Computational Mechanics

Cite this

Three-dimensional integration of heterogeneous silicon micro-structures by liftoff and stamping transfer. / Onoe, Hiroaki; Iwase, Eiji; Matsumoto, Kiyoshi; Shimoyama, Isao.

In: Journal of Micromechanics and Microengineering, Vol. 17, No. 9, 01.09.2007, p. 1818-1827.

Research output: Contribution to journalArticle

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