The mechanism of three-dimensional leakage current in a corrugated capacitor cell for megabit DRAMs has been clarified both experimentally and theoretically using a 3-D device simulator (CADDETH). This study shows that this current is almost completely defined by using the minimum value of the potential barrier height between cells. This is the case even if there is a complicated potential form due to three-dimensional effects and/or sophisticated device structures. Furthermore, the three-dimensional effects in the leakage current caused by back bias penetration are discussed in detail. On the basis of these results, significant guidelines are proposed for trench capacitor cells.
|Title of host publication||Conference on Solid State Devices and Materials|
|Place of Publication||Tokyo, Jpn|
|Publisher||Japan Soc of Applied Physics|
|Number of pages||4|
|Publication status||Published - 1985|
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