Fingerprint
Dive into the research topics of 'Through-silicon-via assignment for 3D ICs'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Through-silicon-via assignment for 3D ICs
Jianchang Ao*, Sheqin Dong, Song Chen, Satoshi Goto
*Corresponding author for this work
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution