Towards Application Portability on Blockchains

Kazuyuki Shudo, Reiki Kanda, Kenji Saito

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

We discuss the issue of what we call incentive mismatch, a fundamental problem with public blockchains supported by economic incentives. This is an open problem, but one potential solution is to make application portable. Portability is desirable for applications on private blockchains. Then, we present examples of middleware designs that enable application portability and, in particular, support migration between blockchains.

Original languageEnglish
Title of host publicationProceedings of 2018 1st IEEE International Conference on Hot Information-Centric Networking, HotICN 2018
EditorsLei Kai
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages51-55
Number of pages5
ISBN (Electronic)9781538648704
DOIs
Publication statusPublished - 2019 Jan 8
Externally publishedYes
Event1st IEEE International Conference on Hot Information-Centric Networking, HotICN 2018 - Shenzhen,Guangdong, China
Duration: 2018 Aug 152018 Aug 17

Publication series

NameProceedings of 2018 1st IEEE International Conference on Hot Information-Centric Networking, HotICN 2018

Conference

Conference1st IEEE International Conference on Hot Information-Centric Networking, HotICN 2018
CountryChina
CityShenzhen,Guangdong
Period18/8/1518/8/17

Keywords

  • application portability
  • blockchain
  • incentive mismatch
  • migration between blockchains

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Information Systems

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  • Cite this

    Shudo, K., Kanda, R., & Saito, K. (2019). Towards Application Portability on Blockchains. In L. Kai (Ed.), Proceedings of 2018 1st IEEE International Conference on Hot Information-Centric Networking, HotICN 2018 (pp. 51-55). [8605977] (Proceedings of 2018 1st IEEE International Conference on Hot Information-Centric Networking, HotICN 2018). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/HOTICN.2018.8605977