Transmission electron microscopy study of electroless NiP and Cu films at initial deposition stage

Takayuki Homma, K. Naito, M. Takai, Tetsuya Osaka, Y. Yamazaki, T. Namikawa

Research output: Contribution to journalArticle

39 Citations (Scopus)

Abstract

Microstructures of electroless NiP and Cu films at the initial deposition stages, deposited onto dielectric substrates, were examined by transmission electron microscopy. The difference in the initial deposition conditions between NiP and Cu films was clearly observed; it is suggested that their growth processes depended mainly on the initial crystalline states. The NiP deposits consist of very fine component crystallites that grow isotropically to form uniform and spherical grains. On the other hand, the Cu deposits are composed of larger component crystallites. They grow along their crystalline axes with random orientation, resulting in their angular and irregular deposition conditions.

Original languageEnglish
Pages (from-to)1269-1274
Number of pages6
JournalJournal of the Electrochemical Society
Volume138
Issue number5
Publication statusPublished - 1991 May

Fingerprint

Transmission electron microscopy
Crystallites
transmission electron microscopy
crystallites
Deposits
deposits
Crystalline materials
Crystal orientation
microstructure
Microstructure
Substrates

ASJC Scopus subject areas

  • Electrochemistry
  • Surfaces, Coatings and Films
  • Surfaces and Interfaces

Cite this

Transmission electron microscopy study of electroless NiP and Cu films at initial deposition stage. / Homma, Takayuki; Naito, K.; Takai, M.; Osaka, Tetsuya; Yamazaki, Y.; Namikawa, T.

In: Journal of the Electrochemical Society, Vol. 138, No. 5, 05.1991, p. 1269-1274.

Research output: Contribution to journalArticle

@article{1482baeaee4c417bbbb286788c08ec8d,
title = "Transmission electron microscopy study of electroless NiP and Cu films at initial deposition stage",
abstract = "Microstructures of electroless NiP and Cu films at the initial deposition stages, deposited onto dielectric substrates, were examined by transmission electron microscopy. The difference in the initial deposition conditions between NiP and Cu films was clearly observed; it is suggested that their growth processes depended mainly on the initial crystalline states. The NiP deposits consist of very fine component crystallites that grow isotropically to form uniform and spherical grains. On the other hand, the Cu deposits are composed of larger component crystallites. They grow along their crystalline axes with random orientation, resulting in their angular and irregular deposition conditions.",
author = "Takayuki Homma and K. Naito and M. Takai and Tetsuya Osaka and Y. Yamazaki and T. Namikawa",
year = "1991",
month = "5",
language = "English",
volume = "138",
pages = "1269--1274",
journal = "Journal of the Electrochemical Society",
issn = "0013-4651",
publisher = "Electrochemical Society, Inc.",
number = "5",

}

TY - JOUR

T1 - Transmission electron microscopy study of electroless NiP and Cu films at initial deposition stage

AU - Homma, Takayuki

AU - Naito, K.

AU - Takai, M.

AU - Osaka, Tetsuya

AU - Yamazaki, Y.

AU - Namikawa, T.

PY - 1991/5

Y1 - 1991/5

N2 - Microstructures of electroless NiP and Cu films at the initial deposition stages, deposited onto dielectric substrates, were examined by transmission electron microscopy. The difference in the initial deposition conditions between NiP and Cu films was clearly observed; it is suggested that their growth processes depended mainly on the initial crystalline states. The NiP deposits consist of very fine component crystallites that grow isotropically to form uniform and spherical grains. On the other hand, the Cu deposits are composed of larger component crystallites. They grow along their crystalline axes with random orientation, resulting in their angular and irregular deposition conditions.

AB - Microstructures of electroless NiP and Cu films at the initial deposition stages, deposited onto dielectric substrates, were examined by transmission electron microscopy. The difference in the initial deposition conditions between NiP and Cu films was clearly observed; it is suggested that their growth processes depended mainly on the initial crystalline states. The NiP deposits consist of very fine component crystallites that grow isotropically to form uniform and spherical grains. On the other hand, the Cu deposits are composed of larger component crystallites. They grow along their crystalline axes with random orientation, resulting in their angular and irregular deposition conditions.

UR - http://www.scopus.com/inward/record.url?scp=0026153756&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0026153756&partnerID=8YFLogxK

M3 - Article

VL - 138

SP - 1269

EP - 1274

JO - Journal of the Electrochemical Society

JF - Journal of the Electrochemical Society

SN - 0013-4651

IS - 5

ER -