Two methods for improving electrochemical migration resistance of printed wiring boards

Yoshimichi Ohki, Y. Hirose, G. Wada, H. Asakawa, T. Tanaka, T. Maeno, K. Okamoto

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    2 Citations (Scopus)

    Abstract

    Experiments were carried out using space charge distribution measurements as a major measurement method in order to find effective measures to suppress electrochemical migration (ECM) along the thickness direction of a printed wiring board (PWB). As a result, the following valuable knowledge was obtained. First, in a PWB consisting of paper/ phenol-resin composite and a copper electrode, the electrical resistivity of epoxy resin used as an adhesive layer to connect the composite and the electrode is usually higher than that of the composite. In such a case, ECM is easily grown in the PWB. The resistance against ECM was found to increase significantly if we use an adhesive layer with a similar electrical resistivity to the insulating material in a PWB. Another important fact is that the growth of ECM can be suppressed if silica nanofillers were added to epoxy resin in the case of an epoxy-based PWB.

    Original languageEnglish
    Title of host publicationICHVE 2012 - 2012 International Conference on High Voltage Engineering and Application
    Pages548-552
    Number of pages5
    DOIs
    Publication statusPublished - 2012
    Event2012 International Conference on High Voltage Engineering and Application, ICHVE 2012 - Shanghai
    Duration: 2012 Sep 172012 Sep 20

    Other

    Other2012 International Conference on High Voltage Engineering and Application, ICHVE 2012
    CityShanghai
    Period12/9/1712/9/20

    Fingerprint

    Printed circuit boards
    Epoxy resins
    Adhesives
    Composite materials
    Electrodes
    Insulating materials
    Charge distribution
    Electric space charge
    Phenols
    Resins
    Silica
    Copper
    Experiments

    Keywords

    • electrochemical migration
    • printed wiring board

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering

    Cite this

    Ohki, Y., Hirose, Y., Wada, G., Asakawa, H., Tanaka, T., Maeno, T., & Okamoto, K. (2012). Two methods for improving electrochemical migration resistance of printed wiring boards. In ICHVE 2012 - 2012 International Conference on High Voltage Engineering and Application (pp. 548-552). [6357042] https://doi.org/10.1109/ICHVE.2012.6357042

    Two methods for improving electrochemical migration resistance of printed wiring boards. / Ohki, Yoshimichi; Hirose, Y.; Wada, G.; Asakawa, H.; Tanaka, T.; Maeno, T.; Okamoto, K.

    ICHVE 2012 - 2012 International Conference on High Voltage Engineering and Application. 2012. p. 548-552 6357042.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Ohki, Y, Hirose, Y, Wada, G, Asakawa, H, Tanaka, T, Maeno, T & Okamoto, K 2012, Two methods for improving electrochemical migration resistance of printed wiring boards. in ICHVE 2012 - 2012 International Conference on High Voltage Engineering and Application., 6357042, pp. 548-552, 2012 International Conference on High Voltage Engineering and Application, ICHVE 2012, Shanghai, 12/9/17. https://doi.org/10.1109/ICHVE.2012.6357042
    Ohki Y, Hirose Y, Wada G, Asakawa H, Tanaka T, Maeno T et al. Two methods for improving electrochemical migration resistance of printed wiring boards. In ICHVE 2012 - 2012 International Conference on High Voltage Engineering and Application. 2012. p. 548-552. 6357042 https://doi.org/10.1109/ICHVE.2012.6357042
    Ohki, Yoshimichi ; Hirose, Y. ; Wada, G. ; Asakawa, H. ; Tanaka, T. ; Maeno, T. ; Okamoto, K. / Two methods for improving electrochemical migration resistance of printed wiring boards. ICHVE 2012 - 2012 International Conference on High Voltage Engineering and Application. 2012. pp. 548-552
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