Two methods for improving electrochemical migration resistance of printed wiring boards

Y. Ohki, Y. Hirose, G. Wada, H. Asakawa, T. Tanaka, T. Maeno, K. Okamoto

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Experiments were carried out using space charge distribution measurements as a major measurement method in order to find effective measures to suppress electrochemical migration (ECM) along the thickness direction of a printed wiring board (PWB). As a result, the following valuable knowledge was obtained. First, in a PWB consisting of paper/ phenol-resin composite and a copper electrode, the electrical resistivity of epoxy resin used as an adhesive layer to connect the composite and the electrode is usually higher than that of the composite. In such a case, ECM is easily grown in the PWB. The resistance against ECM was found to increase significantly if we use an adhesive layer with a similar electrical resistivity to the insulating material in a PWB. Another important fact is that the growth of ECM can be suppressed if silica nanofillers were added to epoxy resin in the case of an epoxy-based PWB.

Original languageEnglish
Title of host publicationICHVE 2012 - 2012 International Conference on High Voltage Engineering and Application
Pages548-552
Number of pages5
DOIs
Publication statusPublished - 2012 Dec 31
Event2012 International Conference on High Voltage Engineering and Application, ICHVE 2012 - Shanghai, China
Duration: 2012 Sep 172012 Sep 20

Publication series

NameICHVE 2012 - 2012 International Conference on High Voltage Engineering and Application

Conference

Conference2012 International Conference on High Voltage Engineering and Application, ICHVE 2012
CountryChina
CityShanghai
Period12/9/1712/9/20

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Keywords

  • electrochemical migration
  • printed wiring board

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Ohki, Y., Hirose, Y., Wada, G., Asakawa, H., Tanaka, T., Maeno, T., & Okamoto, K. (2012). Two methods for improving electrochemical migration resistance of printed wiring boards. In ICHVE 2012 - 2012 International Conference on High Voltage Engineering and Application (pp. 548-552). [6357042] (ICHVE 2012 - 2012 International Conference on High Voltage Engineering and Application). https://doi.org/10.1109/ICHVE.2012.6357042