Ultra small fiber-optic electric field probe fabricated by aerosol deposition

M. Iwanami; M. Nakada; H. Tsuda; K. Ohashi; J. Akedo

doi:10.1109/ISAF.2007.4393419

Ultra small fiber-optic electric field probe fabricated by aerosol deposition

M. Iwanami, M. Nakada, H. Tsuda, K. Ohashi, J. Akedo

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

We developed a microscopic electro-optic field probe by directly depositing a lead zirconate-titanate [PbZr_0.3Ti_0.7O₃] film onto optical fiber edge using aerosol deposition. Its fabrication process is virtually self-aligning because there are no complicated procedures such as fine lithography and etching. The lateral size of the film pattern is 125 μm, which is the same as the diameter of a typical single mode fiber, and the thickness is approximately 5 μm. An RF electro-optic signal was successfully measured over a microstrip line. The measurable bandwidth of the probe was over 2 GHz. Because it is very tiny and thin, the developed electro-optic probe has great potential for detailed electrical characterization in the microscopic regions of high performance electronic products such as the interconnecting parts between LSI packages and printed circuit boards and spaces among different LSI chips in a package.

Original language	English
Title of host publication	2007 16th IEEE International Symposium on the Applications of Ferroelectrics, ISAF
Pages	834-837
Number of pages	4
DOIs	https://doi.org/10.1109/ISAF.2007.4393419
Publication status	Published - 2007 Dec 1
Externally published	Yes
Event	2007 16th IEEE International Symposium on the Applications of Ferroelectrics, ISAF - Nara-city, Japan Duration: 2007 May 27 → 2007 May 31

Publication series

Name	IEEE International Symposium on Applications of Ferroelectrics

Other

Other	2007 16th IEEE International Symposium on the Applications of Ferroelectrics, ISAF
Country	Japan
City	Nara-city
Period	07/5/27 → 07/5/31

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/ISAF.2007.4393419

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Cite this

Iwanami, M., Nakada, M., Tsuda, H., Ohashi, K., & Akedo, J. (2007). Ultra small fiber-optic electric field probe fabricated by aerosol deposition. In 2007 16th IEEE International Symposium on the Applications of Ferroelectrics, ISAF (pp. 834-837). [4393419] (IEEE International Symposium on Applications of Ferroelectrics). https://doi.org/10.1109/ISAF.2007.4393419

Ultra small fiber-optic electric field probe fabricated by aerosol deposition. / Iwanami, M.; Nakada, M.; Tsuda, H.; Ohashi, K.; Akedo, J.

2007 16th IEEE International Symposium on the Applications of Ferroelectrics, ISAF. 2007. p. 834-837 4393419 (IEEE International Symposium on Applications of Ferroelectrics).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Iwanami, M, Nakada, M, Tsuda, H, Ohashi, K & Akedo, J 2007, Ultra small fiber-optic electric field probe fabricated by aerosol deposition. in 2007 16th IEEE International Symposium on the Applications of Ferroelectrics, ISAF., 4393419, IEEE International Symposium on Applications of Ferroelectrics, pp. 834-837, 2007 16th IEEE International Symposium on the Applications of Ferroelectrics, ISAF, Nara-city, Japan, 07/5/27. https://doi.org/10.1109/ISAF.2007.4393419

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abstract = "We developed a microscopic electro-optic field probe by directly depositing a lead zirconate-titanate [PbZr0.3Ti0.7O3] film onto optical fiber edge using aerosol deposition. Its fabrication process is virtually self-aligning because there are no complicated procedures such as fine lithography and etching. The lateral size of the film pattern is 125 μm, which is the same as the diameter of a typical single mode fiber, and the thickness is approximately 5 μm. An RF electro-optic signal was successfully measured over a microstrip line. The measurable bandwidth of the probe was over 2 GHz. Because it is very tiny and thin, the developed electro-optic probe has great potential for detailed electrical characterization in the microscopic regions of high performance electronic products such as the interconnecting parts between LSI packages and printed circuit boards and spaces among different LSI chips in a package.",

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