Vacuum packaging for microsensors by glass-silicon anodic bonding

H. Henmi, Shuichi Shoji, Y. Shoji, K. Yoshimi, M. Esashi

Research output: Contribution to journalArticle

174 Citations (Scopus)

Abstract

Vacuum packaging by the glass-silicon anodic process is studied. The residual gas generated during the anodic binding process and that desobed from the silicon and glass surface increase the pressure in a sealed cavity. In order to fabricate a vacuum sealed cavity, two methods are proposed to eliminate the residual gas; (i) the residual gases are evacuated through a small opening after bonding and then the opening is plugged by depositing a material in vacuum, (ii) the residual gases are absorbed by a getter inside the sealed cavity. A non-evaporable getter (NEG) is used for the second method. A vacuum sealing of tens of Torr is obtained by the firat method. The second method and a combnation of the two methids enables vacuum sealing at a pressure lower than 10-5Torr. A prototype of a capacitive vacuum sensor is fabricated by using the second method.

Original languageEnglish
Pages (from-to)243-248
Number of pages6
JournalSensors and Actuators: A. Physical
Volume43
Issue number1-3
DOIs
Publication statusPublished - 1994
Externally publishedYes

Fingerprint

Microsensors
Silicon
packaging
Packaging
residual gas
Vacuum
Glass
vacuum
glass
silicon
Gases
sealing
cavities
low pressure
prototypes
sensors
Sensors

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Instrumentation

Cite this

Vacuum packaging for microsensors by glass-silicon anodic bonding. / Henmi, H.; Shoji, Shuichi; Shoji, Y.; Yoshimi, K.; Esashi, M.

In: Sensors and Actuators: A. Physical, Vol. 43, No. 1-3, 1994, p. 243-248.

Research output: Contribution to journalArticle

Henmi, H. ; Shoji, Shuichi ; Shoji, Y. ; Yoshimi, K. ; Esashi, M. / Vacuum packaging for microsensors by glass-silicon anodic bonding. In: Sensors and Actuators: A. Physical. 1994 ; Vol. 43, No. 1-3. pp. 243-248.
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