Vacuum ultraviolet irradiation treatment for reducing goldgold bonding temperature

Akiko Okada; Shuichi Shoji; Masatsugu Nimura; Akitsu Shigetou; Katsuyuki Sakuma; Jun Mizuno

doi:10.2320/matertrans.MF201313

Vacuum ultraviolet irradiation treatment for reducing goldgold bonding temperature

Akiko Okada, Shuichi Shoji, Masatsugu Nimura, Akitsu Shigetou, Katsuyuki Sakuma, Jun Mizuno^*

^*Corresponding author for this work

School of Fundamental Science and Engineering

Research output: Contribution to journal › Article › peer-review

16 Citations (Scopus)

Abstract

Lowerature AuAu bonding was achieved under vacuum ultraviolet irradiation in the presence of oxygen gas (VUV/O3). The Au surfaces obtained after the VUV/O3 treatment were analyzed by X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM) measurements. The results indicate that the amount of carbon-based contaminants was dramatically decreased and that there was no serious damage to Au surfaces caused by the VUV/O3 treatment. The AuAu bonding temperature was successfully reduced to 150°C after the VUV/ O3 treatment. The average shear strength was approximately 56 MPa, and cross-sectional scanning electron microscopy (SEM) images of the bonded samples confirmed the absence of voids and cracks. Therefore, VUV/O3 treatment is highly effective for achieving lowerature AuAu bonding.

Original language	English
Pages (from-to)	2139-2143
Number of pages	5
Journal	Materials Transactions
Volume	54
Issue number	11
DOIs	https://doi.org/10.2320/matertrans.MF201313
Publication status	Published - 2013

Keywords

Bonding
Flip chip
Gold
Micro-bump
Three-dimensional integration
Vacuum ultraviolet

ASJC Scopus subject areas

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

Access to Document

10.2320/matertrans.MF201313

Cite this

@article{aeab5380102640e9bb0f14db448c3d6d,

title = "Vacuum ultraviolet irradiation treatment for reducing goldgold bonding temperature",

abstract = "Lowerature AuAu bonding was achieved under vacuum ultraviolet irradiation in the presence of oxygen gas (VUV/O3). The Au surfaces obtained after the VUV/O3 treatment were analyzed by X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM) measurements. The results indicate that the amount of carbon-based contaminants was dramatically decreased and that there was no serious damage to Au surfaces caused by the VUV/O3 treatment. The AuAu bonding temperature was successfully reduced to 150°C after the VUV/ O3 treatment. The average shear strength was approximately 56 MPa, and cross-sectional scanning electron microscopy (SEM) images of the bonded samples confirmed the absence of voids and cracks. Therefore, VUV/O3 treatment is highly effective for achieving lowerature AuAu bonding.",

keywords = "Bonding, Flip chip, Gold, Micro-bump, Three-dimensional integration, Vacuum ultraviolet",

author = "Akiko Okada and Shuichi Shoji and Masatsugu Nimura and Akitsu Shigetou and Katsuyuki Sakuma and Jun Mizuno",

year = "2013",

doi = "10.2320/matertrans.MF201313",

language = "English",

volume = "54",

pages = "2139--2143",

journal = "Materials Transactions",

issn = "1345-9678",

publisher = "Japan Institute of Metals (JIM)",

number = "11",

}

TY - JOUR

T1 - Vacuum ultraviolet irradiation treatment for reducing goldgold bonding temperature

AU - Okada, Akiko

AU - Shoji, Shuichi

AU - Nimura, Masatsugu

AU - Shigetou, Akitsu

AU - Sakuma, Katsuyuki

AU - Mizuno, Jun

PY - 2013

Y1 - 2013

N2 - Lowerature AuAu bonding was achieved under vacuum ultraviolet irradiation in the presence of oxygen gas (VUV/O3). The Au surfaces obtained after the VUV/O3 treatment were analyzed by X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM) measurements. The results indicate that the amount of carbon-based contaminants was dramatically decreased and that there was no serious damage to Au surfaces caused by the VUV/O3 treatment. The AuAu bonding temperature was successfully reduced to 150°C after the VUV/ O3 treatment. The average shear strength was approximately 56 MPa, and cross-sectional scanning electron microscopy (SEM) images of the bonded samples confirmed the absence of voids and cracks. Therefore, VUV/O3 treatment is highly effective for achieving lowerature AuAu bonding.

AB - Lowerature AuAu bonding was achieved under vacuum ultraviolet irradiation in the presence of oxygen gas (VUV/O3). The Au surfaces obtained after the VUV/O3 treatment were analyzed by X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM) measurements. The results indicate that the amount of carbon-based contaminants was dramatically decreased and that there was no serious damage to Au surfaces caused by the VUV/O3 treatment. The AuAu bonding temperature was successfully reduced to 150°C after the VUV/ O3 treatment. The average shear strength was approximately 56 MPa, and cross-sectional scanning electron microscopy (SEM) images of the bonded samples confirmed the absence of voids and cracks. Therefore, VUV/O3 treatment is highly effective for achieving lowerature AuAu bonding.

KW - Bonding

KW - Flip chip

KW - Gold

KW - Micro-bump

KW - Three-dimensional integration

KW - Vacuum ultraviolet

UR - http://www.scopus.com/inward/record.url?scp=84887431429&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84887431429&partnerID=8YFLogxK

U2 - 10.2320/matertrans.MF201313

DO - 10.2320/matertrans.MF201313

M3 - Article

AN - SCOPUS:84887431429

SN - 1345-9678

VL - 54

SP - 2139

EP - 2143

JO - Materials Transactions

JF - Materials Transactions

IS - 11

ER -

Vacuum ultraviolet irradiation treatment for reducing goldgold bonding temperature

Abstract

Keywords

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this