Vacuum ultraviolet (VUV) and vapor-combined surface modification for hybrid bonding at low temperature and atmospheric pressure

Akitsu Shigetou, Jun Mizuno, Shuichi Shoji

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

High feasibility of the vacuum ultraviolet (VUV) and vapor - combined surface modification method was demonstrated at the temperatures lower than 200 °C and atmospheric pressure, for the power/green electronic materials such as SiC (Si-related semiconductors), and GaN. Hybrid bonding of these materials will be of practical use in obtaining high reliability and performance in thin power devices. The water vapor, which was included in VUV irradiation atmosphere (N<inf>2</inf>) at the tuned amount of exposure ((g/m<sup>3</sup>)·s), helped generate hydrogen and hydroxyl radicals, then resulted in the elimination of surface contaminant, partial deoxidization of native oxide, and the formation of hydrate bridging layers at the same time. According to the change in the generation ratio of bridging layers, the exposure of 3 - 4 × 10<sup>3</sup> (g/m<sup>3</sup>)·s was chosen as a possible process window. Upon heating at 150 - 200 °C, the hydrogen bonds, which were followed by the dehydration inside the bridging layers, formed tight adhesion between the surfaces. Although the bond area was limited due to the partial contact at the touchdown, the interface did not contain readily visible voids.

Original languageEnglish
Title of host publicationICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages239-242
Number of pages4
ISBN (Print)9784904090138
DOIs
Publication statusPublished - 2015 May 20
Event2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, ICEP-IAAC 2015 - Kyoto, Japan
Duration: 2015 Apr 142015 Apr 17

Other

Other2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, ICEP-IAAC 2015
CountryJapan
CityKyoto
Period15/4/1415/4/17

Fingerprint

Atmospheric pressure
Surface treatment
Vapors
Vacuum
Hydrates
Dehydration
Water vapor
Hydrogen bonds
Adhesion
Irradiation
Impurities
Semiconductor materials
Heating
Hydrogen
Temperature
Oxides

Keywords

  • atmospheric pressure
  • GaN
  • hybrid bonding
  • low temperature
  • SiC
  • vacuum ultraviolet (VUV)

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Shigetou, A., Mizuno, J., & Shoji, S. (2015). Vacuum ultraviolet (VUV) and vapor-combined surface modification for hybrid bonding at low temperature and atmospheric pressure. In ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (pp. 239-242). [7111030] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICEP-IAAC.2015.7111030

Vacuum ultraviolet (VUV) and vapor-combined surface modification for hybrid bonding at low temperature and atmospheric pressure. / Shigetou, Akitsu; Mizuno, Jun; Shoji, Shuichi.

ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference. Institute of Electrical and Electronics Engineers Inc., 2015. p. 239-242 7111030.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Shigetou, A, Mizuno, J & Shoji, S 2015, Vacuum ultraviolet (VUV) and vapor-combined surface modification for hybrid bonding at low temperature and atmospheric pressure. in ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference., 7111030, Institute of Electrical and Electronics Engineers Inc., pp. 239-242, 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, ICEP-IAAC 2015, Kyoto, Japan, 15/4/14. https://doi.org/10.1109/ICEP-IAAC.2015.7111030
Shigetou A, Mizuno J, Shoji S. Vacuum ultraviolet (VUV) and vapor-combined surface modification for hybrid bonding at low temperature and atmospheric pressure. In ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference. Institute of Electrical and Electronics Engineers Inc. 2015. p. 239-242. 7111030 https://doi.org/10.1109/ICEP-IAAC.2015.7111030
Shigetou, Akitsu ; Mizuno, Jun ; Shoji, Shuichi. / Vacuum ultraviolet (VUV) and vapor-combined surface modification for hybrid bonding at low temperature and atmospheric pressure. ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference. Institute of Electrical and Electronics Engineers Inc., 2015. pp. 239-242
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