Vacuum ultraviolet (VUV) surface treatment process for flip chip and 3-D interconnections

K. Sakuma*, N. Nagai, J. Mizuno, S. Shoji

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Vacuum ultraviolet (VUV) surface treatment process for flip chip and 3-D interconnections'. Together they form a unique fingerprint.

Engineering & Materials Science

Chemical Compounds