TY - GEN
T1 - Vibration-triggered self-assembly of caged droplets to construct a droplet interface bilayer network
AU - Yasuga, Hiroki
AU - Osaki, Toshihisa
AU - Kamiya, Koki
AU - Kawano, Ryuji
AU - Miki, Norihisa
AU - Takeuchi, Shoji
PY - 2016/2/26
Y1 - 2016/2/26
N2 - This paper proposes a self-assembly method to construct a droplet interface bilayer (DIB) network. The DIB network has been developed for biological logical circuits or chemical microreactors, using incorporated membrane proteins. In this work, the DIB network was constructed by using multi-geometric Droplet-Boxes (DBs), which captured and stabilized an aqueous droplet in organic solvent. The multi-geometry enabled DB tessellation, and DIB network was constructed along the tessellation. Vibration triggered self-assembly of the tessellation with a help of capillary force. DIBs were verified by electrical measurement of α-Hemolysin (αHL). The proposed method demonstrated the potential of DIB network formation with good configurability and yield; hence, facilitates design of biological logical circuits based on DIB network.
AB - This paper proposes a self-assembly method to construct a droplet interface bilayer (DIB) network. The DIB network has been developed for biological logical circuits or chemical microreactors, using incorporated membrane proteins. In this work, the DIB network was constructed by using multi-geometric Droplet-Boxes (DBs), which captured and stabilized an aqueous droplet in organic solvent. The multi-geometry enabled DB tessellation, and DIB network was constructed along the tessellation. Vibration triggered self-assembly of the tessellation with a help of capillary force. DIBs were verified by electrical measurement of α-Hemolysin (αHL). The proposed method demonstrated the potential of DIB network formation with good configurability and yield; hence, facilitates design of biological logical circuits based on DIB network.
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U2 - 10.1109/MEMSYS.2016.7421593
DO - 10.1109/MEMSYS.2016.7421593
M3 - Conference contribution
AN - SCOPUS:84971014042
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 200
EP - 202
BT - MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016
Y2 - 24 January 2016 through 28 January 2016
ER -