Void formation and reliability in gold-aluminum bonding

T. Uno, Kohei Tatsumi, Y. Ohno

Research output: Chapter in Book/Report/Conference proceedingConference contribution

26 Citations (Scopus)

Abstract

Voids formed in gold-aluminum intermetallic compounds are known to degrade the long-term reliability of gold wire bonds to aluminum pads. We have investigated the diffusion behavior in the bonds annealed at elevated temperatures. The annealing environment has great influence on the voiding as well as the intermetallic formation. The ball bonds to aluminum pads after annealing in gaseous environments (Ar, N2, Ar+3%H2, Ar+500ppmO2 and air) exhibited sizable voids in the gold/compound interface causing the bond failure. However in the case of vacuum annealing the shear strength increases. The compound layer grows uniformly across the entire interface. There are no deleterious voids observed. It is confirmed that high reliability in the gold/aluminum interface can be obtained by vacuum annealing. Effects of the thickness of aluminum pads and bonding conditions on the voiding have been investigated.

Original languageEnglish
Title of host publicationAmerican Society of Mechanical Engineers, EEP
Place of PublicationNew York, NY, United States
PublisherPubl by ASME
Pages771-777
Number of pages7
Volume2
ISBN (Print)0791807665
Publication statusPublished - 1992
Externally publishedYes
EventProceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2) - Milpitas, CA, USA
Duration: 1992 Apr 91992 Apr 12

Other

OtherProceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2)
CityMilpitas, CA, USA
Period92/4/992/4/12

Fingerprint

Gold
Aluminum
Annealing
Intermetallics
Gold compounds
Vacuum
Shear strength
Wire
Air
Temperature

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering

Cite this

Uno, T., Tatsumi, K., & Ohno, Y. (1992). Void formation and reliability in gold-aluminum bonding. In American Society of Mechanical Engineers, EEP (Vol. 2, pp. 771-777). New York, NY, United States: Publ by ASME.

Void formation and reliability in gold-aluminum bonding. / Uno, T.; Tatsumi, Kohei; Ohno, Y.

American Society of Mechanical Engineers, EEP. Vol. 2 New York, NY, United States : Publ by ASME, 1992. p. 771-777.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Uno, T, Tatsumi, K & Ohno, Y 1992, Void formation and reliability in gold-aluminum bonding. in American Society of Mechanical Engineers, EEP. vol. 2, Publ by ASME, New York, NY, United States, pp. 771-777, Proceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2), Milpitas, CA, USA, 92/4/9.
Uno T, Tatsumi K, Ohno Y. Void formation and reliability in gold-aluminum bonding. In American Society of Mechanical Engineers, EEP. Vol. 2. New York, NY, United States: Publ by ASME. 1992. p. 771-777
Uno, T. ; Tatsumi, Kohei ; Ohno, Y. / Void formation and reliability in gold-aluminum bonding. American Society of Mechanical Engineers, EEP. Vol. 2 New York, NY, United States : Publ by ASME, 1992. pp. 771-777
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