Void formation and reliability in gold-aluminum bonding

T. Uno, K. Tatsumi, Y. Ohno

Research output: Chapter in Book/Report/Conference proceedingConference contribution

26 Citations (Scopus)

Abstract

Voids formed in gold-aluminum intermetallic compounds are known to degrade the long-term reliability of gold wire bonds to aluminum pads. We have investigated the diffusion behavior in the bonds annealed at elevated temperatures. The annealing environment has great influence on the voiding as well as the intermetallic formation. The ball bonds to aluminum pads after annealing in gaseous environments (Ar, N2, Ar+3%H2, Ar+500ppmO2 and air) exhibited sizable voids in the gold/compound interface causing the bond failure. However in the case of vacuum annealing the shear strength increases. The compound layer grows uniformly across the entire interface. There are no deleterious voids observed. It is confirmed that high reliability in the gold/aluminum interface can be obtained by vacuum annealing. Effects of the thickness of aluminum pads and bonding conditions on the voiding have been investigated.

Original languageEnglish
Title of host publicationAmerican Society of Mechanical Engineers, EEP
PublisherPubl by ASME
Pages771-777
Number of pages7
ISBN (Print)0791807665
Publication statusPublished - 1992 Dec 1
EventProceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2) - Milpitas, CA, USA
Duration: 1992 Apr 91992 Apr 12

Publication series

NameAmerican Society of Mechanical Engineers, EEP
Volume2

Other

OtherProceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2)
CityMilpitas, CA, USA
Period92/4/992/4/12

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering

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  • Cite this

    Uno, T., Tatsumi, K., & Ohno, Y. (1992). Void formation and reliability in gold-aluminum bonding. In American Society of Mechanical Engineers, EEP (pp. 771-777). (American Society of Mechanical Engineers, EEP; Vol. 2). Publ by ASME.