Void-free trench-filling by electroless copper deposition using the combination of accelerating and inhibiting additives

Madoka Hasegawa, Yutaka Okinaka, Yosi Shacham-Diamand, Tetsuya Osaka

Research output: Contribution to journalArticle

36 Citations (Scopus)

Abstract

Electroless copper deposition was performed on submicrometer-trench patterned substrates with a bath containing 8-hydroxy-7-iodo-5-quinoline sulfonic acid (HIQSA) as an accelerating additive and polyethylene glycol (PEG) as an inhibiting additive. Void-free copper filling of trenches was achieved by the addition of both HIQSA and PEG at specific concentrations. Copper deposition rate measurements revealed that HIQSA accelerated the deposition only when it was added together with a very low concentration of PEG. The void-free filling is considered to have resulted from the significant acceleration brought about by HIQSA at the trench bottom, where the concentration of PEG is low.

Original languageEnglish
Article number008608ESL
JournalElectrochemical and Solid-State Letters
Volume9
Issue number8
DOIs
Publication statusPublished - 2006 Aug

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Sulfonic Acids
sulfonic acid
quinoline
Polyethylene glycols
glycols
polyethylenes
Copper
voids
copper
Acids
Deposition rates
low concentrations
baths
Substrates

ASJC Scopus subject areas

  • Electrochemistry
  • Materials Science(all)

Cite this

Void-free trench-filling by electroless copper deposition using the combination of accelerating and inhibiting additives. / Hasegawa, Madoka; Okinaka, Yutaka; Shacham-Diamand, Yosi; Osaka, Tetsuya.

In: Electrochemical and Solid-State Letters, Vol. 9, No. 8, 008608ESL, 08.2006.

Research output: Contribution to journalArticle

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