Void-free trench-filling by electroless copper deposition using the combination of accelerating and inhibiting additives

Madoka Hasegawa, Yutaka Okinaka, Yosi Shacham-Diamand, Tetsuya Osaka

Research output: Contribution to journalArticlepeer-review

38 Citations (Scopus)

Abstract

Electroless copper deposition was performed on submicrometer-trench patterned substrates with a bath containing 8-hydroxy-7-iodo-5-quinoline sulfonic acid (HIQSA) as an accelerating additive and polyethylene glycol (PEG) as an inhibiting additive. Void-free copper filling of trenches was achieved by the addition of both HIQSA and PEG at specific concentrations. Copper deposition rate measurements revealed that HIQSA accelerated the deposition only when it was added together with a very low concentration of PEG. The void-free filling is considered to have resulted from the significant acceleration brought about by HIQSA at the trench bottom, where the concentration of PEG is low.

Original languageEnglish
Article number008608ESL
Pages (from-to)C138-C140
JournalElectrochemical and Solid-State Letters
Volume9
Issue number8
DOIs
Publication statusPublished - 2006 Aug 1

ASJC Scopus subject areas

  • Chemical Engineering(all)
  • Materials Science(all)
  • Physical and Theoretical Chemistry
  • Electrochemistry
  • Electrical and Electronic Engineering

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