Abstract
Hybrid bonding among Cu, Ti, quartz, and polydimethylsiloxane (PDMS) substrate, by using vacuum ultraviolet (VUV) irradiation and vapor-assisted surface modification processes, turned out highly feasible at 150 °C and atmospheric pressure. Such a hybrid bonding will be of practical use in the 3D integrations of flex transparent substrates and interconnection layers, which are often used in the optical and MEMS (Micro Electro Mechanical Systems) packaging. Bridging molecular layers, which are based on metal hydroxide hydrates and hydrophilic functional groups, were prepared by introducing water vapor onto the surfaces modified with VUV irradiation in nitrogen atmosphere. The x-ray photoelectron microcopy (XPS) results showed that the initial contaminant layers were successfully removed and water molecules could be adsorbed easily. Upon heating at 150 °C, all combinations of starting materials were bonded through amorphous bridging layers, where the intermolecular dehydration inside the layers created tight adhesion. The interface between transparent materials enabled considerably low loss of light transmittance of less than 5 % in the wavelength range of 380-960 nm.
| Original language | English |
|---|---|
| Title of host publication | ICSJ 2013 - IEEE CPMT Symposium Japan |
| Publisher | IEEE Computer Society |
| DOIs | |
| Publication status | Published - 2013 |
| Event | 2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013 - Kyoto Duration: 2013 Nov 11 → 2013 Nov 13 |
Other
| Other | 2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013 |
|---|---|
| City | Kyoto |
| Period | 13/11/11 → 13/11/13 |
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Keywords
- atmospheric pressure
- hybrid bonding
- low temperature
- transparancy
- VUV
ASJC Scopus subject areas
- Electrical and Electronic Engineering
Cite this
VUV-assisted low temperature bonding for organic/inorganic hybrid integration at atmospheric pressure. / Shigetou, Akitsu; Ajayan, Mano; Mizuno, Jun.
ICSJ 2013 - IEEE CPMT Symposium Japan. IEEE Computer Society, 2013. 6756119.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - VUV-assisted low temperature bonding for organic/inorganic hybrid integration at atmospheric pressure
AU - Shigetou, Akitsu
AU - Ajayan, Mano
AU - Mizuno, Jun
PY - 2013
Y1 - 2013
N2 - Hybrid bonding among Cu, Ti, quartz, and polydimethylsiloxane (PDMS) substrate, by using vacuum ultraviolet (VUV) irradiation and vapor-assisted surface modification processes, turned out highly feasible at 150 °C and atmospheric pressure. Such a hybrid bonding will be of practical use in the 3D integrations of flex transparent substrates and interconnection layers, which are often used in the optical and MEMS (Micro Electro Mechanical Systems) packaging. Bridging molecular layers, which are based on metal hydroxide hydrates and hydrophilic functional groups, were prepared by introducing water vapor onto the surfaces modified with VUV irradiation in nitrogen atmosphere. The x-ray photoelectron microcopy (XPS) results showed that the initial contaminant layers were successfully removed and water molecules could be adsorbed easily. Upon heating at 150 °C, all combinations of starting materials were bonded through amorphous bridging layers, where the intermolecular dehydration inside the layers created tight adhesion. The interface between transparent materials enabled considerably low loss of light transmittance of less than 5 % in the wavelength range of 380-960 nm.
AB - Hybrid bonding among Cu, Ti, quartz, and polydimethylsiloxane (PDMS) substrate, by using vacuum ultraviolet (VUV) irradiation and vapor-assisted surface modification processes, turned out highly feasible at 150 °C and atmospheric pressure. Such a hybrid bonding will be of practical use in the 3D integrations of flex transparent substrates and interconnection layers, which are often used in the optical and MEMS (Micro Electro Mechanical Systems) packaging. Bridging molecular layers, which are based on metal hydroxide hydrates and hydrophilic functional groups, were prepared by introducing water vapor onto the surfaces modified with VUV irradiation in nitrogen atmosphere. The x-ray photoelectron microcopy (XPS) results showed that the initial contaminant layers were successfully removed and water molecules could be adsorbed easily. Upon heating at 150 °C, all combinations of starting materials were bonded through amorphous bridging layers, where the intermolecular dehydration inside the layers created tight adhesion. The interface between transparent materials enabled considerably low loss of light transmittance of less than 5 % in the wavelength range of 380-960 nm.
KW - atmospheric pressure
KW - hybrid bonding
KW - low temperature
KW - transparancy
KW - VUV
UR - http://www.scopus.com/inward/record.url?scp=84897490081&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84897490081&partnerID=8YFLogxK
U2 - 10.1109/ICSJ.2013.6756119
DO - 10.1109/ICSJ.2013.6756119
M3 - Conference contribution
AN - SCOPUS:84897490081
BT - ICSJ 2013 - IEEE CPMT Symposium Japan
PB - IEEE Computer Society
ER -