VUV-assisted low temperature bonding for organic/inorganic hybrid integration at atmospheric pressure

Akitsu Shigetou, Mano Ajayan, Jun Mizuno

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

Hybrid bonding among Cu, Ti, quartz, and polydimethylsiloxane (PDMS) substrate, by using vacuum ultraviolet (VUV) irradiation and vapor-assisted surface modification processes, turned out highly feasible at 150 °C and atmospheric pressure. Such a hybrid bonding will be of practical use in the 3D integrations of flex transparent substrates and interconnection layers, which are often used in the optical and MEMS (Micro Electro Mechanical Systems) packaging. Bridging molecular layers, which are based on metal hydroxide hydrates and hydrophilic functional groups, were prepared by introducing water vapor onto the surfaces modified with VUV irradiation in nitrogen atmosphere. The x-ray photoelectron microcopy (XPS) results showed that the initial contaminant layers were successfully removed and water molecules could be adsorbed easily. Upon heating at 150 °C, all combinations of starting materials were bonded through amorphous bridging layers, where the intermolecular dehydration inside the layers created tight adhesion. The interface between transparent materials enabled considerably low loss of light transmittance of less than 5 % in the wavelength range of 380-960 nm.

Original languageEnglish
Title of host publicationICSJ 2013 - IEEE CPMT Symposium Japan
PublisherIEEE Computer Society
DOIs
Publication statusPublished - 2013
Event2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013 - Kyoto
Duration: 2013 Nov 112013 Nov 13

Other

Other2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013
CityKyoto
Period13/11/1113/11/13

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Keywords

  • atmospheric pressure
  • hybrid bonding
  • low temperature
  • transparancy
  • VUV

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Shigetou, A., Ajayan, M., & Mizuno, J. (2013). VUV-assisted low temperature bonding for organic/inorganic hybrid integration at atmospheric pressure. In ICSJ 2013 - IEEE CPMT Symposium Japan [6756119] IEEE Computer Society. https://doi.org/10.1109/ICSJ.2013.6756119