VUV/O3 assisted single crystal quartz bonding with amorphous SiO2 intermedicate layer for manufacturing optical low pass filter

Bo Ma, Hiroyuki Kuwae, Akiko Okada, Weixin Fu, Shuichi Shoji, Jun Mizuno

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

We proposed a single crystal quartz direct bonding method utilizing amorphous SiO2 intermediated layers, which can improve heat resistance of the optical low pass filter (OLPF) by novel fabrication method. An amorphous SiO2 was deposited on the opposite sides of both infrared reflection and anti-reflection coated substrates to prepare the highly activated surfaces. The substrates were bonded at 200 °C after the vacuum ultraviolet (VUV) /O3 pre-treatment. The bonded sample with amorphous SiO2 layer shows 5 times higher tensile strength than that without amorphous SiO2 layer while it keeps nearly 100% of light transmittance. These results indicate that amorphous SiO2 layer could prepare activate surface even in low vacuum bonding condition. This single crystal bonding method will be useful for realizing high performance OLPFs.

Original languageEnglish
Title of host publication2016 International Conference on Electronics Packaging, ICEP 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages447-450
Number of pages4
ISBN (Electronic)9784904090176
DOIs
Publication statusPublished - 2016 Jun 7
Event2016 International Conference on Electronics Packaging, ICEP 2016 - Hokkaido, Japan
Duration: 2016 Apr 202016 Apr 22

Other

Other2016 International Conference on Electronics Packaging, ICEP 2016
CountryJapan
CityHokkaido
Period16/4/2016/4/22

Fingerprint

Quartz
Optical filters
Low pass filters
Single crystals
Vacuum
Substrates
Heat resistance
Tensile strength
Infrared radiation
Fabrication

Keywords

  • Amorphous SiO2 inserted bonding (AIB) method
  • Direct bonding
  • Low temperature
  • Optical low pass filter
  • Single crystal quartz
  • Vacuum ultraviolet

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering
  • Mechanics of Materials

Cite this

Ma, B., Kuwae, H., Okada, A., Fu, W., Shoji, S., & Mizuno, J. (2016). VUV/O3 assisted single crystal quartz bonding with amorphous SiO2 intermedicate layer for manufacturing optical low pass filter. In 2016 International Conference on Electronics Packaging, ICEP 2016 (pp. 447-450). [7486866] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICEP.2016.7486866

VUV/O3 assisted single crystal quartz bonding with amorphous SiO2 intermedicate layer for manufacturing optical low pass filter. / Ma, Bo; Kuwae, Hiroyuki; Okada, Akiko; Fu, Weixin; Shoji, Shuichi; Mizuno, Jun.

2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., 2016. p. 447-450 7486866.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ma, B, Kuwae, H, Okada, A, Fu, W, Shoji, S & Mizuno, J 2016, VUV/O3 assisted single crystal quartz bonding with amorphous SiO2 intermedicate layer for manufacturing optical low pass filter. in 2016 International Conference on Electronics Packaging, ICEP 2016., 7486866, Institute of Electrical and Electronics Engineers Inc., pp. 447-450, 2016 International Conference on Electronics Packaging, ICEP 2016, Hokkaido, Japan, 16/4/20. https://doi.org/10.1109/ICEP.2016.7486866
Ma B, Kuwae H, Okada A, Fu W, Shoji S, Mizuno J. VUV/O3 assisted single crystal quartz bonding with amorphous SiO2 intermedicate layer for manufacturing optical low pass filter. In 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc. 2016. p. 447-450. 7486866 https://doi.org/10.1109/ICEP.2016.7486866
Ma, Bo ; Kuwae, Hiroyuki ; Okada, Akiko ; Fu, Weixin ; Shoji, Shuichi ; Mizuno, Jun. / VUV/O3 assisted single crystal quartz bonding with amorphous SiO2 intermedicate layer for manufacturing optical low pass filter. 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., 2016. pp. 447-450
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