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Wafer bonding of SiC-AlN at room temperature for all-SiC capacitive pressure sensor
Fengwen Mu, Yang Xu, Seongbin Shin, Yinghui Wang*, Hengyu Xu, Haiping Shang, Yechao Sun, Lei Yue, Tatsurou Tsuyuki, Tadatomo Suga, Weibing Wang, Dapeng Chen
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review
2
Citations
(Scopus)