学術院に属する研究所

  • Japan

研究成果

フィルター
Conference contribution
2019

A Traffic-robust routing algorithm for network-on-chip systems

Xu, S., Meyer, M. C., Jiang, X. & Watanabe, T., 2019 10, Proceedings - 2019 IEEE 13th International Symposium on Embedded Multicore/Many-Core Systems-on-Chip, MCSoC 2019. Institute of Electrical and Electronics Engineers Inc., p. 209-216 8 p. 8906674. (Proceedings - 2019 IEEE 13th International Symposium on Embedded Multicore/Many-Core Systems-on-Chip, MCSoC 2019).

研究成果: Conference contribution

1 引用 (Scopus)

Automatic Training Data Generation Method for Pixel-Level Road Lane Segmentation

Pan, X., Wu, Y. & Ogai, H., 2019 1 1, Genetic and Evolutionary Computing - Proceedings of the 12th International Conference on Genetic and Evolutionary Computing, 2018. Tseng, S-P., Sui, B., Pan, J-S. & Lin, J. C-W. (版). Springer-Verlag, p. 473-481 9 p. (Advances in Intelligent Systems and Computing; 巻数 834).

研究成果: Conference contribution

Base station allocation for users with overlapping coverage in wirelessly networked disaster areas

Wang, Y., Meyer, M. C. & Wang, J., 2019 8, Proceedings - IEEE 17th International Conference on Dependable, Autonomic and Secure Computing, IEEE 17th International Conference on Pervasive Intelligence and Computing, IEEE 5th International Conference on Cloud and Big Data Computing, 4th Cyber Science and Technology Congress, DASC-PiCom-CBDCom-CyberSciTech 2019. Institute of Electrical and Electronics Engineers Inc., p. 954-960 7 p. 8890266. (Proceedings - IEEE 17th International Conference on Dependable, Autonomic and Secure Computing, IEEE 17th International Conference on Pervasive Intelligence and Computing, IEEE 5th International Conference on Cloud and Big Data Computing, 4th Cyber Science and Technology Congress, DASC-PiCom-CBDCom-CyberSciTech 2019).

研究成果: Conference contribution

Broadband Far-infrared Spectroscopic Identification and Quantification of Antioxidants in Polymeric Insulation

Ogishima, T., Kozai, T., Hirai, N. & Ohki, Y., 2019 2 13, ICHVE 2018 - 2018 IEEE International Conference on High Voltage Engineering and Application. Institute of Electrical and Electronics Engineers Inc., 8641948. (ICHVE 2018 - 2018 IEEE International Conference on High Voltage Engineering and Application).

研究成果: Conference contribution

1 引用 (Scopus)

Cognitive Workload Detection from Raw EEG-Signals of Vehicle Driver using Deep Learning

Almogbel, M. A., Dang, A. H. & Kameyama, W., 2019 4 29, 21st International Conference on Advanced Communication Technology: ICT for 4th Industrial Revolution!, ICACT 2019 - Proceeding. Institute of Electrical and Electronics Engineers Inc., p. 1167-1172 6 p. 8702048. (International Conference on Advanced Communication Technology, ICACT; 巻数 2019-February).

研究成果: Conference contribution

Construction of Automatic Scoring System to Support Objective Evaluation of Clinical Skills in Medical Education

Sugamiya, Y., Otani, T., Nakadate, R. & Takanishi, A., 2019 7, 2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2019. Institute of Electrical and Electronics Engineers Inc., p. 4177-4181 5 p. 8856335. (Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS).

研究成果: Conference contribution

Content-Oriented Common IoT Platform for Emergency Management Scenarios

Wen, Z., Qi, X., Yu, K., Lopez, J. E. & Sato, T., 2019 11, 2019 22nd International Symposium on Wireless Personal Multimedia Communications, WPMC 2019. IEEE Computer Society, 9096208. (International Symposium on Wireless Personal Multimedia Communications, WPMC; 巻数 2019-November).

研究成果: Conference contribution

Convolutional Neural Network based Inverse Tone Mapping for High Dynamic Range Display using LUCORE

Hirao, K., Cheng, Z., Takeuchi, M. & Katto, J., 2019 3 6, 2019 IEEE International Conference on Consumer Electronics, ICCE 2019. Institute of Electrical and Electronics Engineers Inc., 8662048. (2019 IEEE International Conference on Consumer Electronics, ICCE 2019).

研究成果: Conference contribution

2 引用 (Scopus)

Degradation in Dielectric Behavior of Soft Epoxy Resin by Concurrent Aging with Heat and Radiation

Ishii, H., Yamaguchi, H., Mori, K., Hirai, N. & Ohki, Y., 2019 10, 2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 18-21 4 p. 9010557. (Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP; 巻数 2019-October).

研究成果: Conference contribution

Degradation in Mechanical and Dielectric Properties of Silicone Rubber under Severe Aging Conditions

Hirai, N., Kaneko, T., Ito, S., Minakawa, T. & Ohki, Y., 2019 10, 2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 126-129 4 p. 9009713. (Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP; 巻数 2019-October).

研究成果: Conference contribution

Degradation of silicone rubber analyzed by instrumental analyses and dielectric spectroscopy

Ohki, Y., Hirai, N., Min, D., Yang, L. & Li, S., 2019 1 1, Minerals, Metals and Materials Series. Springer International Publishing, p. 1323-1332 10 p. (Minerals, Metals and Materials Series).

研究成果: Conference contribution

1 引用 (Scopus)

Derivation of an Optimum and Allowable Range of Pan and Tilt Angles in External Sideway Views for Grasping and Placing Tasks in Unmanned Construction Based on Human Object Recognition

Sato, R., Kamezaki, M., Niuchi, S., Sugano, S. & Iwata, H., 2019 4 25, Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019. Institute of Electrical and Electronics Engineers Inc., p. 776-781 6 p. 8700335. (Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019).

研究成果: Conference contribution

2 引用 (Scopus)

Design and evaluation of a robot limb for table key playing on humanoid saxophonist robot

Lin, J. Y., Nishio, Y., Kawai, M., Matsuki, K., Sessa, S., Cosentino, S. & Takanishi, A., 2019 4 25, Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019. Institute of Electrical and Electronics Engineers Inc., p. 799-804 6 p. 8700424. (Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019).

研究成果: Conference contribution

Design and Evaluation of a Training system to Increase Knee Extension Load during Walking

Gu, Z., Maamari, M. S. A., Zhang, D., Kawakami, Y., Cosentino, S. & Takanishi, A., 2019 8, Proceedings of 2019 IEEE International Conference on Mechatronics and Automation, ICMA 2019. Institute of Electrical and Electronics Engineers Inc., p. 1288-1293 6 p. 8816555. (Proceedings of 2019 IEEE International Conference on Mechatronics and Automation, ICMA 2019).

研究成果: Conference contribution

Design and Initial Validity Study of Perception-Empathy Biofeedback System for Gait Training in Older Adults

Yasuda, K., Saichi, K. & Iwata, H., 2019 1 16, Proceedings - 2018 IEEE International Conference on Systems, Man, and Cybernetics, SMC 2018. Institute of Electrical and Electronics Engineers Inc., p. 1530-1534 5 p. 8616261. (Proceedings - 2018 IEEE International Conference on Systems, Man, and Cybernetics, SMC 2018).

研究成果: Conference contribution

1 引用 (Scopus)

Design of Power and Area Efficient Lower-Part-OR Approximate Multiplier

Guo, Y., Sun, H. & Kimura, S., 2019 2 22, Proceedings of TENCON 2018 - 2018 IEEE Region 10 Conference. Institute of Electrical and Electronics Engineers Inc., p. 2110-2115 6 p. 8650108. (IEEE Region 10 Annual International Conference, Proceedings/TENCON; 巻数 2018-October).

研究成果: Conference contribution

Design of ultrasonic wireless power transfer system

Nagaya, K., Liu, J. & Shimamoto, S., 2019 12, 2019 IEEE Globecom Workshops, GC Wkshps 2019 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 9024399. (2019 IEEE Globecom Workshops, GC Wkshps 2019 - Proceedings).

研究成果: Conference contribution

Detections of pulse and blood pressure employing 5G millimeter wave signal

Yamaoka, Y., Liu, J. & Shimamoto, S., 2019 2 25, 2019 16th IEEE Annual Consumer Communications and Networking Conference, CCNC 2019. Institute of Electrical and Electronics Engineers Inc., 8651697. (2019 16th IEEE Annual Consumer Communications and Networking Conference, CCNC 2019).

研究成果: Conference contribution

Detour Path Angular Information based Range Free Localization with Last Hop RSSI Measurement based Distance Calculation

Paul, A. K., Arifuzzaman, M., Yu, K. & Sato, T., 2019 11, 2019 12th International Conference on Mobile Computing and Ubiquitous Network, ICMU 2019. Institute of Electrical and Electronics Engineers Inc., 9006644. (2019 12th International Conference on Mobile Computing and Ubiquitous Network, ICMU 2019).

研究成果: Conference contribution

1 引用 (Scopus)

Development of a 3-axis human fingertip tactile sensor with an ortho-planar spring

Kristanto, H., Sathe, P., Hsu, C., Schmitz, A., Tomo, T. P., Somlor, S. & Sugano, S., 2019 12, IEEE International Conference on Robotics and Biomimetics, ROBIO 2019. Institute of Electrical and Electronics Engineers Inc., p. 297-302 6 p. 8961678. (IEEE International Conference on Robotics and Biomimetics, ROBIO 2019).

研究成果: Conference contribution

Development of anti-sedimentation magnetorheological fluids and its implementation to MR damper

Zhang, P., Kamezaki, M., Otsuki, K., He, Z., Sakamoto, H. & Sugano, S., 2019 7, Proceedings of the 2019 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2019. Institute of Electrical and Electronics Engineers Inc., p. 400-405 6 p. 8868739. (IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM; 巻数 2019-July).

研究成果: Conference contribution

1 引用 (Scopus)

Development of a Visual Cueing System Using Immersive Virtual Reality for Object-Centered Neglect in Stroke Patients

Hagiwara, A., Yasuda, K., Saichi, K., Muroi, D., Kawaguchi, S., Ohira, M., Matsuda, T. & Iwata, H., 2019 1 16, Proceedings - 2018 IEEE International Conference on Systems, Man, and Cybernetics, SMC 2018. Institute of Electrical and Electronics Engineers Inc., p. 1022-1025 4 p. 8616178. (Proceedings - 2018 IEEE International Conference on Systems, Man, and Cybernetics, SMC 2018).

研究成果: Conference contribution

Development of High-Dorsiflexion Assistive Robotic Technology for Gait Rehabilitation

Hong, J. C., Suzuki, S., Fukushima, Y., Yasuda, K., Ohashi, H. & Iwata, H., 2019 1 16, Proceedings - 2018 IEEE International Conference on Systems, Man, and Cybernetics, SMC 2018. Institute of Electrical and Electronics Engineers Inc., p. 3801-3806 6 p. 8616640. (Proceedings - 2018 IEEE International Conference on Systems, Man, and Cybernetics, SMC 2018).

研究成果: Conference contribution

2 引用 (Scopus)

Discovering latent country words: A step towards cross-cultural emotional communication

Cho, H. & Ishida, T., 2019 1 1, Collaboration Technologies and Social Computing - 25th International Conference, CRIWG+CollabTech 2019, Proceedings. Nakanishi, H., Egi, H., Chounta, I-A., Takada, H., Ichimura, S. & Hoppe, U. (版). Springer-Verlag, p. 232-241 10 p. (Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics); 巻数 11677 LNCS).

研究成果: Conference contribution

Dual Learning-based Video Coding with Inception Dense Blocks

Liu, C., Sun, H., Chen, JA., Cheng, Z., Takeuchi, M., Katto, J., Zeng, X. & Fan, Y., 2019 11, 2019 Picture Coding Symposium, PCS 2019. Institute of Electrical and Electronics Engineers Inc., 8954498. (2019 Picture Coding Symposium, PCS 2019).

研究成果: Conference contribution

2 引用 (Scopus)

Energy-Efficient and High-Speed Approximate Signed Multipliers with Sign-Focused Compressors

Guo, Y., Sun, H. & Kimura, S., 2019 9, Proceedings - 32nd IEEE International System on Chip Conference, SOCC 2019. Zhao, D., Basu, A., Bayoumi, M., Hwee, G. B., Tong, G. & Sridhar, R. (版). IEEE Computer Society, p. 330-335 6 p. 9088005. (International System on Chip Conference; 巻数 2019-September).

研究成果: Conference contribution

Experimental Investigation of Optimum and Allowable Range of Side Views for Teleoperated Digging and Release Works by Using Actual Construction Machinery

Sato, R., Kamezaki, M., Yamada, M., Hashimoto, T., Sugano, S. & Iwata, H., 2019 4 25, Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019. Institute of Electrical and Electronics Engineers Inc., p. 788-793 6 p. 8700330. (Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019).

研究成果: Conference contribution

3 引用 (Scopus)

Experimental validation of high-efficiency hydraulic direct-drive system for a biped humanoid robot-Comparison with valve-based control system

Shimizu, J., Otani, T., Mizukami, H., Hashimoto, K. & Takanishi, A., 2019 5, 2019 International Conference on Robotics and Automation, ICRA 2019. Institute of Electrical and Electronics Engineers Inc., p. 9453-9458 6 p. 8793787. (Proceedings - IEEE International Conference on Robotics and Automation; 巻数 2019-May).

研究成果: Conference contribution

1 引用 (Scopus)

Experimental Validation of Hydraulic Interlocking Drive System for Biped Humanoid Robot

Shimizu, J., Otani, T., Mizukami, H., Hashimoto, K. & Takanishi, A., 2019 11, 2019 IEEE/RSJ International Conference on Intelligent Robots and Systems, IROS 2019. Institute of Electrical and Electronics Engineers Inc., p. 7163-7169 7 p. 8968253. (IEEE International Conference on Intelligent Robots and Systems).

研究成果: Conference contribution

Expressive humanoid robot for automatic accompaniment

Xia, G., Kawai, M., Matsuki, K., Fu, M., Cosentino, S., Trovato, G., Dannenberg, R., Sessa, S. & Takanishi, A., 2019, SMC 2016 - 13th Sound and Music Computing Conference, Proceedings. Grossmann, R. & Hajdu, G. (版). Zentrum fur Mikrotonale Musik und Multimediale Komposition (ZM4), Hochschule fur Musik und Theater, p. 506-511 6 p. (SMC 2016 - 13th Sound and Music Computing Conference, Proceedings).

研究成果: Conference contribution

Fast QTMT Partition Decision Algorithm in VVC Intra Coding based on Variance and Gradient

Chen, J., Sun, H., Katto, J., Zeng, X. & Fan, Y., 2019 12, 2019 IEEE International Conference on Visual Communications and Image Processing, VCIP 2019. Institute of Electrical and Electronics Engineers Inc., 8965674. (2019 IEEE International Conference on Visual Communications and Image Processing, VCIP 2019).

研究成果: Conference contribution

4 引用 (Scopus)

Fault-Tolerant traffic-Aware routing algorithm for 3-d photonic networks-on-chip

Meyer, M. C., Wang, Y. & Watanabe, T., 2019 10, Proceedings - 2019 IEEE 13th International Symposium on Embedded Multicore/Many-Core Systems-on-Chip, MCSoC 2019. Institute of Electrical and Electronics Engineers Inc., p. 172-179 8 p. 8906716. (Proceedings - 2019 IEEE 13th International Symposium on Embedded Multicore/Many-Core Systems-on-Chip, MCSoC 2019).

研究成果: Conference contribution

1 引用 (Scopus)

Four Single-Sideband M-QAM Modulation using Soft Input Soft Output Equalizer over OFDM

Mustafa, A. M., Nguyen, Q. N., Sato, T. & Ohta, G. I., 2019 1 16, 2018 28th International Telecommunication Networks and Applications Conference, ITNAC 2018. Institute of Electrical and Electronics Engineers Inc., 8615451. (2018 28th International Telecommunication Networks and Applications Conference, ITNAC 2018).

研究成果: Conference contribution

2 引用 (Scopus)

Fully homomorphic encryption with table lookup for privacy-preserving smart grid

Li, R., Ishimaki, Y. & Yamana, H., 2019 6, Proceedings - 2019 IEEE International Conference on Smart Computing, SMARTCOMP 2019. Institute of Electrical and Electronics Engineers Inc., p. 19-24 6 p. 8784092. (Proceedings - 2019 IEEE International Conference on Smart Computing, SMARTCOMP 2019).

研究成果: Conference contribution

1 引用 (Scopus)

GaN-SiC and GaN-diamond integration via room temperature bonding

Mu, F. & Suga, T., 2019 5 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735398. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

Heatsink design using spiral-fins considering additive manufacturing

Otake, S., Tateishi, Y., Gohara, H., Kato, R., Ikeda, Y., Parque, V., Faiz, M. K., Yoshida, M. & Miyashita, T., 2019 4, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 46-51 6 p. 8733558. (2019 International Conference on Electronics Packaging, ICEP 2019).

研究成果: Conference contribution

High temperature resistant packaging technology for SiC power module by using Ni micro-plating bonding

Tatsumi, K., Morisako, I., Wada, K., Fukuomori, M., Iizuka, T., Sato, N., Shimizu, K., Ueda, K., Hikita, M., Kamimura, R., Kawanabe, N., Sugiura, K., Tsuruta, K. & Toda, K., 2019 5, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers Inc., p. 1451-1456 6 p. 8811270. (Proceedings - Electronic Components and Technology Conference; 巻数 2019-May).

研究成果: Conference contribution

1 引用 (Scopus)

How People Attribute Minds to Non-Living Entities

Ishii, T. & Watanabe, K., 2019 4 10, 2019 11th International Conference on Knowledge and Smart Technology, KST 2019. Institute of Electrical and Electronics Engineers Inc., p. 213-217 5 p. 8687324. (2019 11th International Conference on Knowledge and Smart Technology, KST 2019).

研究成果: Conference contribution

1 引用 (Scopus)

Improvement of H.265/HEVC Encoding for 8K UHDTV by GOP Size and Prediction Mode Selection

Sakamoto, Y., Yokoyama, R., Takeuchi, M., Matsuo, Y. & Katto, J., 2019 3 6, 2019 IEEE International Conference on Consumer Electronics, ICCE 2019. Institute of Electrical and Electronics Engineers Inc., 8662077. (2019 IEEE International Conference on Consumer Electronics, ICCE 2019).

研究成果: Conference contribution

Integration of GaN-SiC and GaN-diamond by surface activated bonding methods

Mu, F. & Suga, T., 2019 4 1, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 198-199 2 p. 8733419. (2019 International Conference on Electronics Packaging, ICEP 2019).

研究成果: Conference contribution

1 引用 (Scopus)

IoT Device Virtualization for Efficient Resource Utilization in Smart City IoT Platform

Ogawa, K., Kanai, K., Nakamura, K., Kanemitsu, H., Katto, J. & Nakazato, H., 2019 3, 2019 IEEE International Conference on Pervasive Computing and Communications Workshops, PerCom Workshops 2019. Institute of Electrical and Electronics Engineers Inc., p. 419-422 4 p. 8730806. (2019 IEEE International Conference on Pervasive Computing and Communications Workshops, PerCom Workshops 2019).

研究成果: Conference contribution

5 引用 (Scopus)

Learning image and video compression through spatial-temporal energy compaction

Cheng, Z., Sun, H., Takeuchi, M. & Katto, J., 2019 6, Proceedings - 2019 IEEE/CVF Conference on Computer Vision and Pattern Recognition, CVPR 2019. IEEE Computer Society, p. 10063-10072 10 p. 8953743. (Proceedings of the IEEE Computer Society Conference on Computer Vision and Pattern Recognition; 巻数 2019-June).

研究成果: Conference contribution

7 引用 (Scopus)

Light-weight video coding based on perceptual video quality for live streaming

Sakamoto, Y., Saika, S., Takeuchi, M., Nagashima, T., Cheng, Z., Kanai, K., Katto, J., Wei, K., Zengwei, J. & Wei, X., 2019 1 4, Proceedings - 2018 IEEE International Symposium on Multimedia, ISM 2018. Institute of Electrical and Electronics Engineers Inc., p. 139-142 4 p. 8603274. (Proceedings - 2018 IEEE International Symposium on Multimedia, ISM 2018).

研究成果: Conference contribution

Local Features in Angry Faces Capture Attention in Children with Autism Spectrum Disorders Exhibiting Local-Biased Perceptual Characteristics

Isomura, T., Ogawa, S. & Masataka, N., 2019 4 10, 2019 11th International Conference on Knowledge and Smart Technology, KST 2019. Institute of Electrical and Electronics Engineers Inc., p. 203-207 5 p. 8687532. (2019 11th International Conference on Knowledge and Smart Technology, KST 2019).

研究成果: Conference contribution

Low-Cost Approximate Multiplier Design using Probability-Driven Inexact Compressors

Guo, Y., Sun, H., Guo, L. & Kimura, S., 2019 1 8, 2018 IEEE Asia Pacific Conference on Circuits and Systems, APCCAS 2018. Institute of Electrical and Electronics Engineers Inc., p. 291-294 4 p. 8605570. (2018 IEEE Asia Pacific Conference on Circuits and Systems, APCCAS 2018).

研究成果: Conference contribution

5 引用 (Scopus)

Low-cost congestion detection mechanism for networks-on-chip

Han, Z., Meyer, M. C., Jiang, X. & Watanabe, T., 2019 10, Proceedings - 2019 IEEE 13th International Symposium on Embedded Multicore/Many-Core Systems-on-Chip, MCSoC 2019. Institute of Electrical and Electronics Engineers Inc., p. 157-163 7 p. 8906521. (Proceedings - 2019 IEEE 13th International Symposium on Embedded Multicore/Many-Core Systems-on-Chip, MCSoC 2019).

研究成果: Conference contribution

1 引用 (Scopus)

Minimising Makespan of Discrete Controllers: A Qualitative Approach

Castellano, E., Braberman, V., D'Ippolito, N., Uchitel, S. & Tei, K., 2019 12, 2019 IEEE 58th Conference on Decision and Control, CDC 2019. Institute of Electrical and Electronics Engineers Inc., p. 1068-1075 8 p. 9029766. (Proceedings of the IEEE Conference on Decision and Control; 巻数 2019-December).

研究成果: Conference contribution

Modelling and Analysing Resilient Cyber-Physical Systems

Bennaceur, A., Ghezzi, C., Tei, K., Kehrer, T., Weyns, D., Calinescu, R., Dustdar, S., Hu, Z., Honiden, S., Ishikawa, F., Jin, Z., Kramer, J., Litoiu, M., Loreti, M., Moreno, G., Muller, H., Nenzi, L., Nuseibeh, B., Pasquale, L., Reisig, W. および3人, Schmidt, H., Tsigkanos, C. & Zhao, H., 2019 5, Proceedings - 2019 IEEE/ACM 14th International Symposium on Software Engineering for Adaptive and Self-Managing Systems, SEAMS 2019. IEEE Computer Society, p. 70-76 7 p. 8787077. (ICSE Workshop on Software Engineering for Adaptive and Self-Managing Systems; 巻数 2019-May).

研究成果: Conference contribution

5 引用 (Scopus)

Nano-Cu paste sintering in Pt-catalyzed formic acid vapor for Cu bonding at a low temperature

Mu, F., Ren, H., Liu, L., Wang, Y., Zou, G. & Suga, T., 2019 4 1, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 365-366 2 p. 8733407. (2019 International Conference on Electronics Packaging, ICEP 2019).

研究成果: Conference contribution

Non-invasive glucose measurement based on ultrasonic transducer and near IR spectrometer

Gao, Y., Yamaoka, Y., Nagao, Y., Liu, J. & Shimamoto, S., 2019 1 1, Mobile and Wireless Technology 2018 - International Conference on Mobile and Wireless Technology ICMWT 2018. Springer-Verlag, p. 33-40 8 p. (Lecture Notes in Electrical Engineering; 巻数 513).

研究成果: Conference contribution