ナノ・ライフ創新研究機構

  • Japan

研究成果 1971 2019

フィルター
Conference contribution
2019

High-aspect-ratio Sub-2-μm vias using thermal imprint with build-up resin

Kamibayashi, T., Kuwae, H., Kishioka, T., Usui, Y., Ohashi, T., Tamura, M., Shoji, S. & Mizuno, J., 2019 1 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 115-118 4 p. 8625825. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; 巻数 2018-October).

研究成果: Conference contribution

Aspect ratio
Resins
Thermosets
Fillers
Silica

Low temperature copper-copper quasi-direct bonding with ultrathin platinum intermediate layer using atomic layer deposition

Yamada, K., Kuwae, H., Kamibayashi, T., Momose, W., Shoji, S. & Mizuno, J., 2019 1 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 123-126 4 p. 8625756. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; 巻数 2018-October).

研究成果: Conference contribution

Atomic layer deposition
Platinum
Copper
Temperature
Ultrathin films

New Era of Device Science

Kasahara, T., Kuwae, H. & Mizuno, J., 2019 4 22, 2019 Pan Pacific Microelectronics Symposium, Pan Pacific 2019. Institute of Electrical and Electronics Engineers Inc., 8696587. (2019 Pan Pacific Microelectronics Symposium, Pan Pacific 2019).

研究成果: Conference contribution

Organic light emitting diodes (OLED)
Nanotechnology
Semiconductor materials
NEMS
Luminescent devices
2018
1 引用 (Scopus)

10μW/cm2-class high power density planar Si-nanowire thermoelectric energy harvester compatible with CMOS-VLSI technology

Tomita, M., Oba, S., Himeda, Y., Yamato, R., Shima, K., Kumada, T., Xu, M., Takezawa, H., Mesaki, K., Tsuda, K., Hashimoto, S., Zhan, T., Zhang, H., Kamakura, Y., Suzuki, Y., Inokawa, H., Ikeda, H., Matsukawa, T., Matsuki, T. & Watanabe, T., 2018 10 25, 2018 IEEE Symposium on VLSI Technology, VLSI Technology 2018. Institute of Electrical and Electronics Engineers Inc., 巻 2018-June. p. 93-94 2 p. 8510659

研究成果: Conference contribution

Harvesters
Thermoelectric power
Nanowires
Demonstrations
Costs

Control for Au-Ag Nanoporous Structure by Electrodeposition and Dealloying

Saito, M., Mizuno, J., Koga, S. & Nishikawa, H., 2018 11 26, 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 8546350

研究成果: Conference contribution

Electrodeposition
Dissolution
Nanopores
Anodic polarization
Glow discharges

Electrodeposition of Gold Electrode on Silicon Wafers for Submillimeter-wave Devices

Saito, M., Seto, H., Inoue, Y. & Hirokawa, J., 2018 11 26, 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 8546341

研究成果: Conference contribution

Submillimeter waves
Silicon wafers
Electrodeposition
Gold
Electrodes

Evaluating the relationship between phonon and thermal properties of group IV alloys using molecular dynamics simulation

Tomita, M., Ogasawara, M., Terada, T. & Watanabe, T., 2018 1 1, ECS Transactions. Hartmann, J-M., Thean, A., Ogura, A., Gong, X., Harame, D., Caymax, M., Niu, G., Schulze, A., Liu, Q., Mashi, G., Miyazaki, S., Mai, A. & Osting, M. (版). 7 版 Electrochemical Society Inc., 巻 86. p. 337-345 9 p.

研究成果: Conference contribution

Molecular dynamics
Thermal conductivity
Thermodynamic properties
Computer simulation
Alloying

Evaluation of laterally graded silicon germanium wires for thermoelectric devices fabricated by rapid melting growth

Yokogawa, R., Hashimoto, S., Takahashi, K., Oba, S., Tomita, M., Kurosawa, M., Watanabe, T. & Ogura, A., 2018 1 1, ECS Transactions. Hartmann, J-M., Thean, A., Ogura, A., Gong, X., Harame, D., Caymax, M., Niu, G., Schulze, A., Liu, Q., Mashi, G., Miyazaki, S., Mai, A. & Osting, M. (版). 7 版 Electrochemical Society Inc., 巻 86. p. 87-93 7 p.

研究成果: Conference contribution

Germanium
Melting
Wire
Silicon
Backscattering

Fabrication of microchannel-TEM grid for in situ liquid observation of interfacial chemical reaction

Miwa, K., Kuwae, H., Sakamoto, K., Shoji, S. & Mizuno, J., 2018 6 6, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018. Institute of Electrical and Electronics Engineers Inc., p. 284-287 4 p.

研究成果: Conference contribution

Microchannels
Chemical reactions
Transmission electron microscopy
Fabrication
Liquids
1 引用 (Scopus)

Longitudinal Leaky Surface Acoustic Wave with Low Attenuation on LiTaO3 Thin Plate Bonded to Quartz Substrate

Hayashi, J., Suzuki, M., Yonai, T., Yamaya, K., Kakio, S., Kishida, K., Asakawa, S., Kuwae, H. & Mizuno, J., 2018 12 17, 2018 IEEE International Ultrasonics Symposium, IUS 2018. IEEE Computer Society, 巻 2018-October. 8579715

研究成果: Conference contribution

thin plates
quartz
attenuation
acoustics
Q factors

Thermoelectric Characteristics of Rapid-Melting-Grown SiGe Wires Measured by Peltier Cooling Experiment

Hashimoto, S., Takahashi, K., Oba, S., Terada, T., Ogasawara, M., Tomita, M., Kurosawa, M. & Watanabe, T., 2018 7 26, 2018 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 283-285 3 p. 8421517

研究成果: Conference contribution

Melting
Wire
Cooling
Experiments
Seed
2017
8 引用 (Scopus)

A scalable Si-based micro thermoelectric generator

Watanabe, T., Asada, S., Xu, T., Hashimoto, S., Ohba, S., Himeda, Y., Yamato, R., Zhang, H., Tomita, M., Matsukawa, T., Kamakura, Y. & Ikeda, H., 2017 6 13, 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 86-87 2 p. 7947519

研究成果: Conference contribution

Thermoelectric power
Nanowires
Heat transfer
Silicon
Substrates
1 引用 (Scopus)

A study on low temperature SAM modified POM direct bonding affected by VUV/O3 irradiation

Fu, W., Ma, B., Kuwae, H., Shoji, S. & Mizuno, J., 2017 6 13, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., p. 69 1 p. 7947465

研究成果: Conference contribution

Self assembled monolayers
Irradiation
Surface treatment
Temperature
MEMS

Cu-Cu direct bonding by introducing Au intermediate layer

Noma, H., Kamibayashi, T., Kuwae, H., Suzuki, N., Nonaka, T., Shoji, S. & Mizuno, J., 2017 6 13, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., p. 70 1 p. 7947466

研究成果: Conference contribution

Gold
Fans

Deep-blue light emission with a wide-bandgap naphthalene-derivative liquid organic semiconductor host

Kobayashi, N., Kuwae, H., Oshima, J., Ishimatsu, R., Tashiro, S., Imato, T., Adachi, C., Shoji, S. & Mizuno, J., 2017, Organic Photonic Materials and Devices XIX 2017. SPIE, 巻 10101. 101011B

研究成果: Conference contribution

Organic Semiconductors
Blue Light
Semiconducting organic compounds
Light emission
organic semiconductors

Fabrication of self-standing curved film with pillar arrays by large area spherical soft-UV imprint lithography

Kamibayashi, T., Kuwae, H., Nobori, A., Shoji, S. & Mizuno, J., 2017 6 5, 2017 International Conference on Electronics Packaging, ICEP 2017. Institute of Electrical and Electronics Engineers Inc., p. 148-151 4 p. 7939344

研究成果: Conference contribution

Lithography
Fabrication
3D printers
Polydimethylsiloxane
Optical devices

High-coupling leaky SAWs on LiTaO3 thin plate bonded to quartz substrate

Hayashi, J., Gomi, M., Suzuki, M., Kakio, S., Suzaki, H., Yonai, T., Kishida, K. & Mizuno, J., 2017 10 31, 2017 IEEE International Ultrasonics Symposium, IUS 2017. IEEE Computer Society, 8091675

研究成果: Conference contribution

thin plates
quartz
acoustics
aluminum nitrides
phase velocity
6 引用 (Scopus)

High-coupling leaky SAWs on LiTaO3 thin plate bonded to quartz substrate

Hayashi, J., Gomi, M., Suzuki, M., Kakio, S., Suzaki, H., Yonai, T., Kishida, K. & Mizuno, J., 2017 10 31, 2017 IEEE International Ultrasonics Symposium, IUS 2017. IEEE Computer Society, 8091566

研究成果: Conference contribution

thin plates
quartz
acoustics
interdigital transducers
coefficients

Highly bendable transparent electrode using mesh patterned indium tin oxide for flexible electronic devices

Sakamoto, K., Kuwae, H., Kobayashi, N., Nobori, A., Shoji, S. & Mizuno, J., 2017 8 25, 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017. Institute of Electrical and Electronics Engineers Inc., p. 323-326 4 p. 8017034

研究成果: Conference contribution

Flexible electronics
Tin oxides
indium oxides
Indium
tin oxides

Low temperature direct bonding of polyoxymethylene (POM) through self assembly monolayer (SAM)

Fu, W., Kuwae, H., Ma, B., Shoji, S. & Mizuno, J., 2017 6 5, 2017 International Conference on Electronics Packaging, ICEP 2017. Institute of Electrical and Electronics Engineers Inc., p. 167-170 4 p. 7939349

研究成果: Conference contribution

Self assembly
Monolayers
Electron devices
Temperature
Debonding
1 引用 (Scopus)

Nano-scale evaluation of electrical tree initiation in silica/epoxy nano-composite thin film

Onishi, T., Hashimoto, S., Tomita, M., Watanabe, T., Mura, K., Tsuda, T. & Yoshimitsu, T., 2017 10 27, Proceedings of 2017 International Symposium on Electrical Insulating Materials, ISEIM 2017. Institute of Electrical Engineers of Japan, 巻 1. p. 359-362 4 p.

研究成果: Conference contribution

Composite films
Silicon Dioxide
Nanocomposite films
Nanocomposites
Silica

Plate-laminated corporate-feed slotted waveguide array antenna at 350-GHz band by silicon process

Tekkouk, K., Hirokawa, J., Oogimoto, K., Nagatsuma, T., Seto, H., Inoue, Y. & Saito, M., 2017 1 17, ISAP 2016 - International Symposium on Antennas and Propagation. Institute of Electrical and Electronics Engineers Inc., p. 538-539 2 p. 7821191

研究成果: Conference contribution

antenna arrays
Antenna feeders
Antenna arrays
Waveguides
waveguides

Widefield real-time single-cell secretion imaging with optical waveguide technique

Tanaka, Y., Suzuki, N., Mora, K., Mizuno, J., Shoji, S., Uemura, S. & Shirasaki, Y., 2017 7 26, TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems. Institute of Electrical and Electronics Engineers Inc., p. 1580-1583 4 p. 7994363

研究成果: Conference contribution

secretions
Optical waveguides
optical waveguides
Imaging techniques
cells
2016

All-round micro sheath flow formation to realize complex cross sections by simply stacked PDMs structures

Yoon, D., Ariyoshi, L., Tanaka, D., Sekiguchi, T. & Shoji, S., 2016 2 26, MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc., 巻 2016-February. p. 141-144 4 p. 7421578

研究成果: Conference contribution

pulse duration modulation
sheaths
Pulse width modulation
Fabrication
Fluids

Complex check-like cross-sectional flow formation for fiber-shaped materials

Kobayashi, K., Yoon, D., Sekiguchi, T. & Shoji, S., 2016, 20th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2016. Chemical and Biological Microsystems Society, p. 836-837 2 p.

研究成果: Conference contribution

Alginate
Fibers

Corporate-feed slotted wavguide array antenna at 350 GHz band by silicon process

Tekkouk, K., Hirokawa, J., Oogimoto, K., Nagatsuma, T., Seto, H., Inoue, Y. & Saito, M., 2016 10 25, 2016 IEEE Antennas and Propagation Society International Symposium, APSURSI 2016 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 1197-1198 2 p. 7696306

研究成果: Conference contribution

antenna arrays
Antenna feeders
Antenna arrays
Fabrication
Silicon

Development of a simple fabrication process for a printable piezoelectric energy harvest device

Kamata, Y., Yoon, D., Sasaki, T., Nozaki, Y., Yamaura, S., Sekiguchi, T., Nakajima, T. & Shoji, S., 2016 11 28, 2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016. Institute of Electrical and Electronics Engineers Inc., p. 520-523 4 p. 7758304

研究成果: Conference contribution

Fabrication
Ink
Printing
Polymers
Copolymers
2 引用 (Scopus)

Development of interatomic potential of group IV alloy semiconductors for lattice dynamics simulation

Tomita, M., Ogura, A. & Watanabe, T., 2016 1 1, SiGe, Ge, and Related Materials: Materials, Processing, and Devices 7. 8 版 Electrochemical Society Inc., 巻 75. p. 785-794 10 p.

研究成果: Conference contribution

Lattice vibrations
Lattice constants
Semiconductor materials
Molecular dynamics
Computer simulation

Effect of isothermal aging at 250°C on shear strength of joints using Au nanoporous bonding for die attach

Nishikawa, H., Matsunaga, K., Kim, M. S., Saito, M. & Mizuno, J., 2016, IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016. IMAPS-International Microelectronics and Packaging Society

研究成果: Conference contribution

Joining
Shear strength
Aging of materials
High temperature applications
Sintering
2 引用 (Scopus)

Electrodeposition of ZnO from acetate bath for thermoelectric devices

Matsuo, H., Yoshitoku, K., Furuyama, D., Saito, M. & Homma, T., 2016 1 1, General Student Poster Session. 52 版 Electrochemical Society Inc., 巻 75. p. 143-148 6 p.

研究成果: Conference contribution

Electrodeposition
Nitrates
Cracks
Metallic films
Gases

Fabrication process of fluidic devices for producing fine droplets using a focused ion beam system

Nozaki, Y., Kanai, T., Matsuo, A., Tanaka, D., Yuito, I., Takeuchi, T., Sekiguchi, T. & Shoji, S., 2016 11 21, 16th International Conference on Nanotechnology - IEEE NANO 2016. Institute of Electrical and Electronics Engineers Inc., p. 795-798 4 p. 7751484

研究成果: Conference contribution

Fluidic devices
fluidics
Focused ion beams
ion beams
Fabrication

Fifty-second analysis of oxidative stress markers in human plasma using amide-modified liquid chromatography chip

Isokawa, M., Nakanishi, K., Yoon, D., Sekiguchi, T., Funatsu, T., Shoji, S. & Tsunoda, M., 2016, 20th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2016. Chemical and Biological Microsystems Society, p. 583-584 2 p.

研究成果: Conference contribution

Plasma (human)
Oxidative stress
Liquid chromatography
Amides
Acetylcysteine

Flexible organic light emitting diode ribbons using three liquid organic semiconductors

Nobori, A., Kobayashi, N., Kuwae, H., Kasahara, T., Oshima, J., Adachi, C., Shoji, S. & Mizuno, J., 2016 11 28, 2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016. Institute of Electrical and Electronics Engineers Inc., p. 38-41 4 p. 7758195

研究成果: Conference contribution

Semiconducting organic compounds
Organic light emitting diodes (OLED)
Microchannels
Liquids
Electroluminescence
2 引用 (Scopus)

Industrialization trial of a biosensor technology

Ohashi, K. & Osaka, T., 2016 1 1, Contemporary Issues and Case Studies in Electrochemical Innovation 2. 39 版 Electrochemical Society Inc., 巻 75. p. 1-9 9 p.

研究成果: Conference contribution

Ion sensitive field effect transistors
Biosensors
Finance
Chemical sensors
Medicine

In vitro selection of novel peptide agonists for human somatostatin receptor subtype-2 using a water-in-oil microdroplet platform

Sakurai, T., Iizuka, R., Nakamura, Y., Ishii, J., Kondo, A., Iguchi, A., Yoon, D., Sekiguchi, T., Shoji, S. & Funatsu, T., 2016, 20th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2016. Chemical and Biological Microsystems Society, p. 593-594 2 p.

研究成果: Conference contribution

Peptides
Proteins
Water
Ligands
Oils

Low temperature direct bonding of PEEK and Pt through VUV/FAB surface treatments

Fu, W., Shigetou, A., Shoji, S. & Mizuno, J., 2016 6 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 302-305 4 p. 7486834

研究成果: Conference contribution

Polyether ether ketones
Surface treatment
Vacuum
Atoms
Hydrates
1 引用 (Scopus)

Low temperature direct bonding of single crystal quartz substrates for high performance optical low pass filter using amorphous SiO2 intermediate layers

Ma, B., Kuwae, H., Okada, A., Fu, W., Shoji, S. & Mizuno, J., 2016 2 26, MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc., 巻 2016-February. p. 25-28 4 p. 7421548

研究成果: Conference contribution

Quartz
Optical filters
low pass filters
Low pass filters
quartz

Simultaneous fabrication of a through-glass interconnect via and bumps using dry filling process of submicron gold particles

Nomura, K., Okada, A., Shoji, S., Ogashiwa, T. & Mizuno, J., 2016 12 27, 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Proceedings. IEEE Computer Society, p. 270-272 3 p. 7799988

研究成果: Conference contribution

Gold
Fabrication
Glass
Photolithography
Sintering
1 引用 (Scopus)

ST-quartz/LiTaO3 direct bonding using SiO2 amorphous layers with VUV/O3 pre-treatment for a novel 5G surface acoustic wave device

Suzaki, H., Kuwae, H., Okada, A., Ma, B., Shoji, S. & Mizuno, J., 2016 6 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 443-446 4 p. 7486865

研究成果: Conference contribution

Acoustic surface wave devices
Quartz
Vacuum
Substrates
lithium tantalate oxide

Study of LiTaO3/ST-quartz Bonding with Amorphous Interlayer Assisted by VUV/O3 Treatment for SAW Device

Suzaki, H., Kuwae, H., Okada, A., Shoji, S. & Mizuno, J., 2016 12 27, 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Proceedings. IEEE Computer Society, p. 239-242 4 p. 7799986

研究成果: Conference contribution

Acoustic surface wave devices
Quartz
Substrates
Single crystals
Surface waves
1 引用 (Scopus)

VUV/O3 assisted single crystal quartz bonding with amorphous SiO2 intermedicate layer for manufacturing optical low pass filter

Ma, B., Kuwae, H., Okada, A., Fu, W., Shoji, S. & Mizuno, J., 2016 6 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 447-450 4 p. 7486866

研究成果: Conference contribution

Quartz
Optical filters
Low pass filters
Single crystals
Vacuum
2015

Culture-independent method for screening and identifying microbial enzyme-encoding genes using microdroplet-based single cell genomics

Nakamura, K., Iizuka, R., Yoshida, T., Hatada, Y., Takaki, Y., Nishi, S., Iguchi, A., Yoon, D., Sekiguchi, T., Shoji, S. & Funatsu, T., 2015, MicroTAS 2015 - 19th International Conference on Miniaturized Systems for Chemistry and Life Sciences. Chemical and Biological Microsystems Society, p. 513-515 3 p.

研究成果: Conference contribution

Gene encoding
Screening
Enzymes
Catalyst activity
Bacteria
1 引用 (Scopus)

Effect of Au nanoporous structure on bonding strength

Matsunaga, K., Kim, M. S., Nishikawa, H., Saito, M. & Mizuno, J., 2015 5 20, ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference. Institute of Electrical and Electronics Engineers Inc., p. 830-833 4 p. 7111127

研究成果: Conference contribution

Joining
Nanoparticles
Binary alloys
Nanostructured materials
Shear strength

Fabrication of a hermetic sealing device having I-structure TGV filled with submicron gold particles

Nomura, K., Okada, A., Shoji, S., Ogashiwa, T. & Mizuno, J., 2015 12 23, 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 46-49 4 p. 7365176

研究成果: Conference contribution

Gold
Fabrication
Glass
Vacuum
Hermetic
1 引用 (Scopus)

Fabrication of a hermetic sealing device using low temperature intrinsic-silicon/glass bonding

Nomura, K., Mizuno, J., Okada, A., Shoji, S. & Ogashiwa, T., 2015 5 20, ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference. Institute of Electrical and Electronics Engineers Inc., p. 444-447 4 p. 7111054

研究成果: Conference contribution

Glass bonding
Fabrication
Glass
Silicon
Temperature

Fabrication of plate-laminated waveguide for 350GHz band by silicon process

Hirokawa, J., Suetsugu, S., Minamikata, Y., Nagatsuma, T., Seto, H., Inoue, Y. & Saito, M., 2015 10 21, 2015 1st URSI Atlantic Radio Science Conference, URSI AT-RASC 2015. Institute of Electrical and Electronics Engineers Inc., 7302839

研究成果: Conference contribution

tolerance
Waveguides
Fabrication
Silicon
Antenna arrays
1 引用 (Scopus)

High efficient synthesis of manganese(II), cobalt(II) complexes containing lysozyme using reaction area separated micro fluidic device

Tanaka, D., Murakoshi, Y., Tsuda, E., Mitsumoto, Y., Yoon, D., Sekiguchi, T., Akitsu, T. & Shoji, S., 2015 8 5, 2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015. Institute of Electrical and Electronics Engineers Inc., p. 243-246 4 p. 7180907

研究成果: Conference contribution

Fluidic devices
microfluidic devices
lysozyme
Microfluidics
Manganese

Highly controllable three-dimensional sheath flow device for fabrication of artificial capillary vessels

Ito, J., Sekine, R., Yoon, D., Nakamura, Y., Oku, H., Nansai, H., Chikasawa, T., Goto, T., Sekiguchi, T., Takeda, N. & Shoji, S., 2015 2 26, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). February 版 Institute of Electrical and Electronics Engineers Inc., 巻 2015-February. p. 480-483 4 p. 7050996

研究成果: Conference contribution

Endothelial cells
sheaths
vessels
microfibers
Fabrication
7 引用 (Scopus)

Hybrid bonding of Cu/Sn microbump and adhesive with silica filler for 3D interconnection of single micron pitch

Ohyama, M., Nimura, M., Mizuno, J., Shoji, S., Tamura, M., Enomoto, T. & Shigetou, A., 2015 7 15, Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., 巻 2015-July. p. 325-330 6 p. 7159612

研究成果: Conference contribution

Silicon Dioxide
Fillers
Adhesives
Silica
Resins
2 引用 (Scopus)

Improved low temperature gold-gold bonding using nanoporous powder bump using vacuum ultraviolet irradiation pre-treatment

Kaneda, T., Mizuno, J., Okada, A., Matsunaga, K., Shoji, S., Saito, M. & Nishikawa, H., 2015 5 20, ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference. Institute of Electrical and Electronics Engineers Inc., p. 473-477 5 p. 7111061

研究成果: Conference contribution

Gold
Irradiation
Vacuum
Powders
Ligaments