ナノ・ライフ創新研究機構

  • Japan

研究成果

フィルター
Conference contribution
2019

Cu-Cu Quasi-Direct Bonding with Atomically Thin-Au and Pt Intermediate Layer Using Atomic Layer Deposition

Kuwae, H., Yamada, K., Momose, W., Shoji, S. & Mizuno, J., 2019 4, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 207-211 5 p. 8733483. (2019 International Conference on Electronics Packaging, ICEP 2019).

研究成果: Conference contribution

1 引用 (Scopus)

High-aspect-ratio Sub-2-μm vias using thermal imprint with build-up resin

Kamibayashi, T., Kuwae, H., Kishioka, T., Usui, Y., Ohashi, T., Tamura, M., Shoji, S. & Mizuno, J., 2019 1 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 115-118 4 p. 8625825. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; 巻数 2018-October).

研究成果: Conference contribution

1 引用 (Scopus)

High-Color-Purity Microfluidic Quantum Dots Light-Emitting Diodes Using the Electroluminescence of the Liquid Organic Semiconductor Backlight

Kawamura, M., Kuwae, H., Kamibayashi, T., Oshima, J., Kasahara, T., Shoji, S. & Mizuno, J., 2019 6, 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII. Institute of Electrical and Electronics Engineers Inc., p. 724-727 4 p. 8808557. (2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII).

研究成果: Conference contribution

1 引用 (Scopus)

High-Efficiency Dibromination of Organic Compound in Microfluidic Channel of SI Pillar Array Directly Coated with Iron Catalys

Sugaya, T., Tanaka, D., Yoon, D. H., Nozaki, Y., Sekiguchi, T., Akitsu, T. & Shoji, S., 2019 6, 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII. Institute of Electrical and Electronics Engineers Inc., p. 2278-2281 4 p. 8808687. (2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII).

研究成果: Conference contribution

Low temperature copper-copper quasi-direct bonding with ultrathin platinum intermediate layer using atomic layer deposition

Yamada, K., Kuwae, H., Kamibayashi, T., Momose, W., Shoji, S. & Mizuno, J., 2019 1 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 123-126 4 p. 8625756. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; 巻数 2018-October).

研究成果: Conference contribution

1 引用 (Scopus)

Study of Low-residual Stress Amorphous Film Deposition Method for LiTaO3/Quartz or LiNbO3/Quartz Bonding toward 5G Surface Acoustic Wave Devices

Tezuka, A., Kuwae, H., Yamada, K., Shoji, S., Kakio, S. & Mizuno, J., 2019 4, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 414-417 4 p. 8733501. (2019 International Conference on Electronics Packaging, ICEP 2019).

研究成果: Conference contribution

Study on role of inserted Pt intermediate layer deposited by atomic layer deposition for Cu-Cu quasi-direct bonding

Yamada, K., Kuwae, H., Kamibayashi, T., Shoji, S., Momose, W. & Mizuno, J., 2019 5, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735244. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

2018

10μW/cm2-class high power density planar Si-nanowire thermoelectric energy harvester compatible with CMOS-VLSI technology

Tomita, M., Oba, S., Himeda, Y., Yamato, R., Shima, K., Kumada, T., Xu, M., Takezawa, H., Mesaki, K., Tsuda, K., Hashimoto, S., Zhan, T., Zhang, H., Kamakura, Y., Suzuki, Y., Inokawa, H., Ikeda, H., Matsukawa, T., Matsuki, T. & Watanabe, T., 2018 10 25, 2018 IEEE Symposium on VLSI Technology, VLSI Technology 2018. Institute of Electrical and Electronics Engineers Inc., 巻 2018-June. p. 93-94 2 p. 8510659

研究成果: Conference contribution

1 引用 (Scopus)

Control for Au-Ag Nanoporous Structure by Electrodeposition and Dealloying

Saito, M., Mizuno, J., Koga, S. & Nishikawa, H., 2018 11 26, 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 8546350

研究成果: Conference contribution

Design Optimization and Fabrication of Simple Printable Piezoelectric Energy Harvest Device

Sasagawa, K., Yoon, D., Sekiguchi, T., Sasaki, T., Nakajima, T. & Shoji, S., 2018 12 3, NEMS 2018 - 13th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems. Institute of Electrical and Electronics Engineers Inc., p. 440-443 4 p. 8556859. (NEMS 2018 - 13th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems).

研究成果: Conference contribution

Electrodeposition of Gold Electrode on Silicon Wafers for Submillimeter-wave Devices

Saito, M., Seto, H., Inoue, Y. & Hirokawa, J., 2018 11 26, 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 8546341

研究成果: Conference contribution

Evaluating the relationship between phonon and thermal properties of group IV alloys using molecular dynamics simulation

Tomita, M., Ogasawara, M., Terada, T. & Watanabe, T., 2018 1 1, ECS Transactions. Hartmann, J-M., Thean, A., Ogura, A., Gong, X., Harame, D., Caymax, M., Niu, G., Schulze, A., Liu, Q., Mashi, G., Miyazaki, S., Mai, A. & Osting, M. (版). 7 版 Electrochemical Society Inc., 巻 86. p. 337-345 9 p.

研究成果: Conference contribution

Evaluation of laterally graded silicon germanium wires for thermoelectric devices fabricated by rapid melting growth

Yokogawa, R., Hashimoto, S., Takahashi, K., Oba, S., Tomita, M., Kurosawa, M., Watanabe, T. & Ogura, A., 2018 1 1, ECS Transactions. Hartmann, J-M., Thean, A., Ogura, A., Gong, X., Harame, D., Caymax, M., Niu, G., Schulze, A., Liu, Q., Mashi, G., Miyazaki, S., Mai, A. & Osting, M. (版). 7 版 Electrochemical Society Inc., 巻 86. p. 87-93 7 p.

研究成果: Conference contribution

1 引用 (Scopus)

Fabrication of microchannel-TEM grid for in situ liquid observation of interfacial chemical reaction

Miwa, K., Kuwae, H., Sakamoto, K., Shoji, S. & Mizuno, J., 2018 6 6, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018. Institute of Electrical and Electronics Engineers Inc., p. 284-287 4 p.

研究成果: Conference contribution

HAMR emulation using plasmonic SERS sensor as near field transducer

Yanagisawa, M., Kunimoto, M., Saito, M. & Homma, T., 2018 1 1, ASME-JSME 2018 Joint International Conference on Information Storage and Processing Systems and Micromechatronics for Information and Precision Equipment, ISPS-MIPE 2018. American Society of Mechanical Engineers (ASME)

研究成果: Conference contribution

1 引用 (Scopus)

Longitudinal Leaky Surface Acoustic Wave with Low Attenuation on LiTaO3 Thin Plate Bonded to Quartz Substrate

Hayashi, J., Suzuki, M., Yonai, T., Yamaya, K., Kakio, S., Kishida, K., Asakawa, S., Kuwae, H. & Mizuno, J., 2018 12 17, 2018 IEEE International Ultrasonics Symposium, IUS 2018. IEEE Computer Society, 巻 2018-October. 8579715

研究成果: Conference contribution

3 引用 (Scopus)

Thermoelectric Characteristics of Rapid-Melting-Grown SiGe Wires Measured by Peltier Cooling Experiment

Hashimoto, S., Takahashi, K., Oba, S., Terada, T., Ogasawara, M., Tomita, M., Kurosawa, M. & Watanabe, T., 2018 7 26, 2018 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 283-285 3 p. 8421517

研究成果: Conference contribution

1 引用 (Scopus)
2017

A scalable Si-based micro thermoelectric generator

Watanabe, T., Asada, S., Xu, T., Hashimoto, S., Ohba, S., Himeda, Y., Yamato, R., Zhang, H., Tomita, M., Matsukawa, T., Kamakura, Y. & Ikeda, H., 2017 6 13, 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 86-87 2 p. 7947519

研究成果: Conference contribution

10 引用 (Scopus)

A study on low temperature SAM modified POM direct bonding affected by VUV/O3 irradiation

Fu, W., Ma, B., Kuwae, H., Shoji, S. & Mizuno, J., 2017 6 13, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., p. 69 1 p. 7947465

研究成果: Conference contribution

1 引用 (Scopus)

Cu-Cu direct bonding by introducing Au intermediate layer

Noma, H., Kamibayashi, T., Kuwae, H., Suzuki, N., Nonaka, T., Shoji, S. & Mizuno, J., 2017 6 13, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., p. 70 1 p. 7947466

研究成果: Conference contribution

Deep-blue light emission with a wide-bandgap naphthalene-derivative liquid organic semiconductor host

Kobayashi, N., Kuwae, H., Oshima, J., Ishimatsu, R., Tashiro, S., Imato, T., Adachi, C., Shoji, S. & Mizuno, J., 2017, Organic Photonic Materials and Devices XIX 2017. SPIE, 巻 10101. 101011B

研究成果: Conference contribution

Fabrication of self-standing curved film with pillar arrays by large area spherical soft-UV imprint lithography

Kamibayashi, T., Kuwae, H., Nobori, A., Shoji, S. & Mizuno, J., 2017 6 5, 2017 International Conference on Electronics Packaging, ICEP 2017. Institute of Electrical and Electronics Engineers Inc., p. 148-151 4 p. 7939344

研究成果: Conference contribution

High-coupling leaky SAWs on LiTaO3 thin plate bonded to quartz substrate

Hayashi, J., Gomi, M., Suzuki, M., Kakio, S., Suzaki, H., Yonai, T., Kishida, K. & Mizuno, J., 2017 10 31, 2017 IEEE International Ultrasonics Symposium, IUS 2017. IEEE Computer Society, 8091566

研究成果: Conference contribution

11 引用 (Scopus)

High-coupling leaky SAWs on LiTaO3 thin plate bonded to quartz substrate

Hayashi, J., Gomi, M., Suzuki, M., Kakio, S., Suzaki, H., Yonai, T., Kishida, K. & Mizuno, J., 2017 10 31, 2017 IEEE International Ultrasonics Symposium, IUS 2017. IEEE Computer Society, 8091675

研究成果: Conference contribution

1 引用 (Scopus)

Highly bendable transparent electrode using mesh patterned indium tin oxide for flexible electronic devices

Sakamoto, K., Kuwae, H., Kobayashi, N., Nobori, A., Shoji, S. & Mizuno, J., 2017 8 25, 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017. Institute of Electrical and Electronics Engineers Inc., p. 323-326 4 p. 8017034

研究成果: Conference contribution

1 引用 (Scopus)

Low temperature direct bonding of polyoxymethylene (POM) through self assembly monolayer (SAM)

Fu, W., Kuwae, H., Ma, B., Shoji, S. & Mizuno, J., 2017 6 5, 2017 International Conference on Electronics Packaging, ICEP 2017. Institute of Electrical and Electronics Engineers Inc., p. 167-170 4 p. 7939349

研究成果: Conference contribution

Nano-scale evaluation of electrical tree initiation in silica/epoxy nano-composite thin film

Onishi, T., Hashimoto, S., Tomita, M., Watanabe, T., Mura, K., Tsuda, T. & Yoshimitsu, T., 2017 10 27, Proceedings of 2017 International Symposium on Electrical Insulating Materials, ISEIM 2017. Institute of Electrical Engineers of Japan, 巻 1. p. 359-362 4 p.

研究成果: Conference contribution

1 引用 (Scopus)

Plate-laminated corporate-feed slotted waveguide array antenna at 350-GHz band by silicon process

Tekkouk, K., Hirokawa, J., Oogimoto, K., Nagatsuma, T., Seto, H., Inoue, Y. & Saito, M., 2017 1 17, ISAP 2016 - International Symposium on Antennas and Propagation. Institute of Electrical and Electronics Engineers Inc., p. 538-539 2 p. 7821191

研究成果: Conference contribution

Widefield real-time single-cell secretion imaging with optical waveguide technique

Tanaka, Y., Suzuki, N., Mora, K., Mizuno, J., Shoji, S., Uemura, S. & Shirasaki, Y., 2017 7 26, TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems. Institute of Electrical and Electronics Engineers Inc., p. 1580-1583 4 p. 7994363. (TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems).

研究成果: Conference contribution

1 引用 (Scopus)
2016

All-round micro sheath flow formation to realize complex cross sections by simply stacked PDMs structures

Yoon, D., Ariyoshi, L., Tanaka, D., Sekiguchi, T. & Shoji, S., 2016 2 26, MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc., 巻 2016-February. p. 141-144 4 p. 7421578

研究成果: Conference contribution

Complex check-like cross-sectional flow formation for fiber-shaped materials

Kobayashi, K., Yoon, D., Sekiguchi, T. & Shoji, S., 2016, 20th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2016. Chemical and Biological Microsystems Society, p. 836-837 2 p.

研究成果: Conference contribution

Corporate-feed slotted wavguide array antenna at 350 GHz band by silicon process

Tekkouk, K., Hirokawa, J., Oogimoto, K., Nagatsuma, T., Seto, H., Inoue, Y. & Saito, M., 2016 10 25, 2016 IEEE Antennas and Propagation Society International Symposium, APSURSI 2016 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 1197-1198 2 p. 7696306

研究成果: Conference contribution

1 引用 (Scopus)

Development of a simple fabrication process for a printable piezoelectric energy harvest device

Kamata, Y., Yoon, D., Sasaki, T., Nozaki, Y., Yamaura, S., Sekiguchi, T., Nakajima, T. & Shoji, S., 2016 11 28, 2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016. Institute of Electrical and Electronics Engineers Inc., p. 520-523 4 p. 7758304

研究成果: Conference contribution

Development of interatomic potential of group IV alloy semiconductors for lattice dynamics simulation

Tomita, M., Ogura, A. & Watanabe, T., 2016 1 1, SiGe, Ge, and Related Materials: Materials, Processing, and Devices 7. 8 版 Electrochemical Society Inc., 巻 75. p. 785-794 10 p.

研究成果: Conference contribution

2 引用 (Scopus)

Effect of isothermal aging at 250°C on shear strength of joints using Au nanoporous bonding for die attach

Nishikawa, H., Matsunaga, K., Kim, M. S., Saito, M. & Mizuno, J., 2016, IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016. IMAPS-International Microelectronics and Packaging Society

研究成果: Conference contribution

Electrodeposition of ZnO from acetate bath for thermoelectric devices

Matsuo, H., Yoshitoku, K., Furuyama, D., Saito, M. & Homma, T., 2016 1 1, General Student Poster Session. 52 版 Electrochemical Society Inc., 巻 75. p. 143-148 6 p.

研究成果: Conference contribution

2 引用 (Scopus)

Fabrication process of fluidic devices for producing fine droplets using a focused ion beam system

Nozaki, Y., Kanai, T., Matsuo, A., Tanaka, D., Yuito, I., Takeuchi, T., Sekiguchi, T. & Shoji, S., 2016 11 21, 16th International Conference on Nanotechnology - IEEE NANO 2016. Institute of Electrical and Electronics Engineers Inc., p. 795-798 4 p. 7751484

研究成果: Conference contribution

Fifty-second analysis of oxidative stress markers in human plasma using amide-modified liquid chromatography chip

Isokawa, M., Nakanishi, K., Yoon, D., Sekiguchi, T., Funatsu, T., Shoji, S. & Tsunoda, M., 2016, 20th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2016. Chemical and Biological Microsystems Society, p. 583-584 2 p.

研究成果: Conference contribution

Flexible organic light emitting diode ribbons using three liquid organic semiconductors

Nobori, A., Kobayashi, N., Kuwae, H., Kasahara, T., Oshima, J., Adachi, C., Shoji, S. & Mizuno, J., 2016 11 28, 2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016. Institute of Electrical and Electronics Engineers Inc., p. 38-41 4 p. 7758195

研究成果: Conference contribution

Industrialization trial of a biosensor technology

Ohashi, K. & Osaka, T., 2016 1 1, Contemporary Issues and Case Studies in Electrochemical Innovation 2. 39 版 Electrochemical Society Inc., 巻 75. p. 1-9 9 p.

研究成果: Conference contribution

2 引用 (Scopus)

In vitro selection of novel peptide agonists for human somatostatin receptor subtype-2 using a water-in-oil microdroplet platform

Sakurai, T., Iizuka, R., Nakamura, Y., Ishii, J., Kondo, A., Iguchi, A., Yoon, D., Sekiguchi, T., Shoji, S. & Funatsu, T., 2016, 20th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2016. Chemical and Biological Microsystems Society, p. 593-594 2 p.

研究成果: Conference contribution

Low temperature direct bonding of PEEK and Pt through VUV/FAB surface treatments

Fu, W., Shigetou, A., Shoji, S. & Mizuno, J., 2016 6 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 302-305 4 p. 7486834

研究成果: Conference contribution

Low temperature direct bonding of single crystal quartz substrates for high performance optical low pass filter using amorphous SiO2 intermediate layers

Ma, B., Kuwae, H., Okada, A., Fu, W., Shoji, S. & Mizuno, J., 2016 2 26, MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc., 巻 2016-February. p. 25-28 4 p. 7421548

研究成果: Conference contribution

3 引用 (Scopus)

Simultaneous fabrication of a through-glass interconnect via and bumps using dry filling process of submicron gold particles

Nomura, K., Okada, A., Shoji, S., Ogashiwa, T. & Mizuno, J., 2016 12 27, 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Proceedings. IEEE Computer Society, p. 270-272 3 p. 7799988

研究成果: Conference contribution

ST-quartz/LiTaO3 direct bonding using SiO2 amorphous layers with VUV/O3 pre-treatment for a novel 5G surface acoustic wave device

Suzaki, H., Kuwae, H., Okada, A., Ma, B., Shoji, S. & Mizuno, J., 2016 6 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 443-446 4 p. 7486865

研究成果: Conference contribution

1 引用 (Scopus)

Study of LiTaO3/ST-quartz Bonding with Amorphous Interlayer Assisted by VUV/O3 Treatment for SAW Device

Suzaki, H., Kuwae, H., Okada, A., Shoji, S. & Mizuno, J., 2016 12 27, 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Proceedings. IEEE Computer Society, p. 239-242 4 p. 7799986

研究成果: Conference contribution

1 引用 (Scopus)

VUV/O3 assisted single crystal quartz bonding with amorphous SiO2 intermedicate layer for manufacturing optical low pass filter

Ma, B., Kuwae, H., Okada, A., Fu, W., Shoji, S. & Mizuno, J., 2016 6 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 447-450 4 p. 7486866

研究成果: Conference contribution

1 引用 (Scopus)
2015

Culture-independent method for screening and identifying microbial enzyme-encoding genes using microdroplet-based single cell genomics

Nakamura, K., Iizuka, R., Yoshida, T., Hatada, Y., Takaki, Y., Nishi, S., Iguchi, A., Yoon, D., Sekiguchi, T., Shoji, S. & Funatsu, T., 2015, MicroTAS 2015 - 19th International Conference on Miniaturized Systems for Chemistry and Life Sciences. Chemical and Biological Microsystems Society, p. 513-515 3 p.

研究成果: Conference contribution

Effect of Au nanoporous structure on bonding strength

Matsunaga, K., Kim, M. S., Nishikawa, H., Saito, M. & Mizuno, J., 2015 5 20, ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference. Institute of Electrical and Electronics Engineers Inc., p. 830-833 4 p. 7111127

研究成果: Conference contribution

1 引用 (Scopus)

Fabrication of a hermetic sealing device having I-structure TGV filled with submicron gold particles

Nomura, K., Okada, A., Shoji, S., Ogashiwa, T. & Mizuno, J., 2015 12 23, 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 46-49 4 p. 7365176

研究成果: Conference contribution